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DSL04-016SC6

STMicroelectronics

DSL04-016SC6 by STMicroelectronics

DSL04-016SC6 by STMicroelectronics is a bidirectional transient voltage suppressor diode ideal for protecting sensitive electronics. It features a max operating temp of 125 °C, min breakdown voltage of 20V, and operates in a compact SMD package. Perfect for applications requiring robust surge protection per IEC standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,835 parts In-Stock

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4,835

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Digiode

USA . 4,789 parts In-Stock

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4,789

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Anansix

USA . 364 parts In-Stock

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364

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Distributors (Availability)

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.093

100+ parts

$0.085

1k+ parts

$0.076

10k+ parts

-

500

$0.093

$0.085

$0.076

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IDEA Electronic Components Group

UK . 689 parts In-Stock

1+ parts

$0.183

100+ parts

-

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$0.165

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689

$0.183

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$0.165

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Corohmni

South Africa . 574 parts In-Stock

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$0.299

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574

$0.299

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MKK Technologies

India . 511 parts In-Stock

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$0.344

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511

$0.344

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DigiPath Technology Company

USA . 511 parts In-Stock

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$0.344

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511

$0.344

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AZTECH Wire

Italy . 107 parts In-Stock

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$15.640

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107

$15.640

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Component Stockers USA

USA . 793 parts In-Stock

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$99.990

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793

$99.990

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Corphita

USA . 1,909 parts In-Stock

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1,909

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Parana Technologies

USA . 1,281 parts In-Stock

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$0.219

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1,281

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$0.219

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Native Components

USA . 534 parts In-Stock

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534

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Northwest PG Solutions

USA . 385 parts In-Stock

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385

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Overview

Experience unparalleled reliability with the DSL04-016SC6 from STMicroelectronics, a leader in innovative electronic solutions. This transient suppression device excels in protecting sensitive components from voltage spikes, ensuring durability in various applications—from consumer electronics to industrial systems. With its robust construction and superior performance standards, this compact solution not only enhances device longevity but also optimizes functionality, giving you peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this device reliable for long-term applications.

Config: SINGLE

A single configuration simplifies integration into circuits, facilitating easier design and reducing overall space requirements.

Surface Mount: YES

Being surface mount compatible allows for high-density circuit designs, making it an excellent choice for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient board space usage, allowing for versatile placement options in compact designs.

No. of Terminals: 6

With six terminals, this device enables flexible connections and enhances design options for engineers and designers.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced footprint on the PCB, making it ideal for size-constrained applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures safe operation in high-temperature environments, increasing reliability in demanding conditions.

Minimum Operating Temperature: -40 °C

The broad operating temperature range from -40 °C allows for usage in extremely cold climates, making this device versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent corrosion resistance and enhances solderability, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility for circuit designers, allowing better layout design on the PCB.

Minimum Breakdown Voltage: 20 V

A minimum breakdown voltage of 20 V provides a substantial safety margin, protecting sensitive circuit components from overvoltage across a variety of applications.

Reference Standard: IEC-61000-4-2, 4-5

Compliance with IEC standards ensures reliable transient suppression and guarantees product performance consistent with international safety and performance standards.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor diode, this device effectively absorbs voltage spikes, enhancing overall circuit protection.

Technology: AVALANCHE

Avalanche technology provides quick response times to transient events, ensuring immediate protection for sensitive electronics.

Terminal Form: GULL WING

The gull wing terminal form aids in easy soldering and assembly, enhancing the manufacturability of the PCB.

Maximum Repetitive Peak Reverse Voltage: 16 V

A low maximum repetitive peak reverse voltage allows for efficient transient suppression in low-voltage applications, ensuring compatibility with a wide range of circuits.

Polarity: BIDIRECTIONAL

Bidirectional capability allows for protection against voltage spikes in both positive and negative directions, providing comprehensive protection.

Diode Element Material: SILICON

Silicon material ensures high performance and reliability of the diode, making it suitable for various electronic applications.

Technical Specifications

Transient Suppression Devices DSL04-016SC6 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

20 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-5

Maximum Repetitive Peak Reverse Voltage:

16 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Trade Compliance

DSL04-016SC6 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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