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BUZ10A

STMicroelectronics

BUZ10A by STMicroelectronics

STMicroelectronics BUZ10A is a N-CHANNEL FET with 50V DS Breakdown Voltage, 17A Drain Current, and 0.12 ohm On Resistance. Ideal for SWITCHING applications due to its 65A Pulsed Drain Current capability and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Vyrian

USA . 1,530 parts In-Stock

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Anansix

USA . 744 parts In-Stock

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Digiode

USA . 742 parts In-Stock

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VNN

France . 360 parts In-Stock

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MISTER SPROCKETS

USA . 200 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 730 parts In-Stock

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$1.454

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$1.308

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$1.454

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MKK Technologies

India . 532 parts In-Stock

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$2.733

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DigiPath Technology Company

USA . 532 parts In-Stock

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$2.733

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AZTECH Wire

Italy . 616 parts In-Stock

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$16.855

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Ampacity Inc.

Singapore . 452 parts In-Stock

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$37.050

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,181 parts In-Stock

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Corphita

USA . 307 parts In-Stock

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Parana Technologies

USA . 98 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the BUZ10A Power FET by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable components that meet the demands of various applications. Whether you need to switch circuits or regulate power, this N-channel transistor with a built-in diode offers exceptional value and benefits. With a maximum pulsing drain current of 65A and a minimum breakdown voltage of 50V, the BUZ10A provides efficient operation and enhanced functionality. Upgrade your designs with this powerful component and experience superior performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties, enhancing the durability and reliability of the product.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified circuit design with built-in diode for ease of use and reduced component count.

Minimum DS Breakdown Voltage: 50 V

Suitable for applications requiring higher voltages, ensuring reliable performance.

Maximum Pulsed Drain Current (IDM): 65 A

Capable of handling high current surges, making it suitable for demanding switching applications.

Maximum Power Dissipation (Abs): 75 W

Allows for efficient heat dissipation, increasing the overall performance and lifespan of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast response times, ideal for switching applications.

Maximum Operating Temperature: 150 °C

Can operate at elevated temperatures without compromising performance, ensuring reliability in various environments.

Maximum Drain-Source On Resistance: 0.12 ohm

Low on-resistance leads to reduced power losses and improved efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) BUZ10A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

FAST SWITCHING

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

65 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUZ10A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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