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AVS10CB/F2

STMicroelectronics

AVS10CB/F2 by STMicroelectronics

STMicroelectronics AVS10CB/F2 is a TRIAC with 3 terminals, 600V voltage, and 8A current. It operates b/w 0-110 °C, with a leakage current of 10uA. Ideal for AC power control applications due to its GULL WING terminal form and RECTANGULAR package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,066 parts In-Stock

1+ parts

-

100+ parts

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3,066

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Anansix

USA . 744 parts In-Stock

1+ parts

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1k+ parts

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744

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Vyrian

USA . 230 parts In-Stock

1+ parts

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230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$3.846

100+ parts

-

1k+ parts

$3.461

10k+ parts

-

1,113

$3.846

-

$3.461

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MKK Technologies

India . 1,061 parts In-Stock

1+ parts

$7.231

100+ parts

-

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10k+ parts

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1,061

$7.231

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DigiPath Technology Company

USA . 1,061 parts In-Stock

1+ parts

$7.231

100+ parts

-

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-

1,061

$7.231

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Corphita

USA . 1,665 parts In-Stock

1+ parts

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1,665

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Northwest PG Solutions

USA . 645 parts In-Stock

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645

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Parana Technologies

USA . 338 parts In-Stock

1+ parts

-

100+ parts

$4.598

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338

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$4.598

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Native Components

USA . 69 parts In-Stock

1+ parts

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69

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Overview

Unlock the potential of your electronic projects with the AVS10CB/F2 by STMicroelectronics. This high-quality TRIAC offers reliable performance and durability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this product provides value and benefits that will enhance your designs. Trust in STMicroelectronics to deliver superior products like the AVS10CB/F2, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the product suitable for a wide range of applications.

Configuration: SINGLE

Simplifies installation and reduces complexity in circuits where only one TRIAC is needed.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving space and reducing overall product size.

Package Shape: RECTANGULAR

Allows for easy integration into circuit designs and board layouts.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Ensures low power consumption and minimal leakage current when the TRIAC is in an off-state, improving energy efficiency.

No. of Terminals: 3

Provides the necessary connections for proper operation while keeping the design simple and straightforward.

Package Style (Meter): FLANGE MOUNT

Offers secure mounting options for easy installation and maintenance.

Maximum Operating Temperature: 110 °C

Can operate effectively in a wide range of temperature conditions, ensuring reliability and stability.

Trigger Device Type: TRIAC

Specifically designed for alternating current applications, providing precise control over power delivery.

Minimum Operating Temperature: 0 °C

Can start operating at low temperatures, making it suitable for various environments and applications.

Terminal Position: SINGLE

Simplifies wiring and connections, reducing the chances of errors in installation.

Maximum RMS On-state Current: 8 A

Capable of handling relatively high current loads, making it suitable for applications that require power switching.

Repetitive Peak Off-state Voltage: 600 V

Provides high voltage tolerance, making it suitable for a wide range of voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

Ensures fast response times and reliable switching, essential for precision control and safety in AC circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) AVS10CB/F2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

KIT COMPOSED OF TRIAC AND CONTROLLER

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

AVS10CB/F2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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