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74VHCT86ATTR

STMicroelectronics

74VHCT86ATTR by STMicroelectronics

74VHCT86ATTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns, operating at a nominal voltage of 5V. It features four functions and two inputs in a compact 14-terminal package. Ideal for military applications, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,317 parts In-Stock

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7,317

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Digiode

USA . 2,909 parts In-Stock

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2,909

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Anansix

USA . 676 parts In-Stock

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676

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Distributors (Availability)

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Northwest PG Solutions

USA . 284 parts In-Stock

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$2.385

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284

$2.385

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

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$13.173

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$11.856

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1,278

$13.173

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$11.856

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Microchip USA

USA . 372 parts In-Stock

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$16.665

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372

$16.665

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$16.691

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$15.189

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$13.687

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1,000

$16.691

$15.189

$13.687

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AZTECH Wire

Italy . 68 parts In-Stock

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$18.370

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68

$18.370

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MKK Technologies

India . 1,357 parts In-Stock

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$24.772

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$24.772

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DigiPath Technology Company

USA . 1,357 parts In-Stock

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$24.772

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1,357

$24.772

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Corohmni

South Africa . 79 parts In-Stock

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$31.286

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79

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Corphita

USA . 4,176 parts In-Stock

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Parana Technologies

USA . 2,229 parts In-Stock

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$15.751

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$15.751

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Native Components

USA . 338 parts In-Stock

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$2.103

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Overview

Unlock the power of efficiency and reliability with the 74VHCT86ATTR from STMicroelectronics! This high-quality logic gate delivers swift performance with a low propagation delay, ensuring your designs are not just functional but optimized for speed. Ideal for diverse applications in advanced electronics, this compact gem is built to withstand demanding environments, providing you with durable solutions that enhance performance while streamlining your projects. Experience the advantage of precision engineering and let your innovations thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 10 ns

With a low propagation delay of 10 ns, this logic gate operates at high speed, facilitating rapid signal processing in electronic circuits.

Surface Mount: YES

The surface mount design allows for more compact circuit board layouts and improves overall assembly efficiency.

No. of Functions: 4

This product supports multiple functions, providing versatility and saving board space by eliminating the need for additional components.

No. of Inputs: 2

Having 2 inputs allows for straightforward logic operations, making integration simple in various digital circuits.

Package Shape: RECTANGULAR

The rectangular package shape enhances layout options and optimizes space management on printed circuit boards (PCBs).

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is standard for many applications, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product is efficient in driving load, minimizing the risk of signal degradation.

Power Supplies (V): 5

Supports a single power supply voltage of 5V, which simplifies circuit design and powers most logic circuits effectively.

No. of Terminals: 14

The 14 terminals provide ample connection points for integration into complex circuitry, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is space-efficient, making it ideal for modern, high-density electronic designs.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps allows the product to drive higher loads without compromising performance.

Propagation Delay (tpd): 10 ns

The repeat of low propagation delay emphasizes the product's high-speed performance, ensuring quick data transmission.

Maximum Operating Temperature: 125 °C

Operating at high temperatures (up to 125 °C) makes this product suitable for automotive and industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliability in extremely cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and provides excellent corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for more flexible PCB layouts and simplified soldering processes.

Maximum Seated Height: 1.2 mm

With a low seated height of 1.2 mm, this product can fit in compact designs without compromising performance.

Width: 4.4 mm

A narrow width of 4.4 mm allows for efficient use of limited PCB space.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows flexibility in power supply selections, catering to a range of applications.

Length: 5 mm

At 5 mm in length, this component is compact, facilitating integration in tight spaces without sacrificing functionality.

Temperature Grade: MILITARY

This military-grade temperature classification indicates high reliability and durability in extreme conditions, making it ideal for defense applications.

Technology: CMOS

CMOS technology allows for low power consumption and high efficiency, essential for battery-operated devices and ensuring longer operation times.

Terminal Form: GULL WING

Gull wing terminals enhance the soldering process, providing easy assembly and maintenance for automated manufacturing processes.

Packing Method: TR

The TR (Tape and Reel) packing method simplifies handling and integration into automated production lines, increasing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is optimal for high-density assembly while maintaining soldering ease and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a variety of power sources, enhancing design flexibility.

Technical Specifications

Logic Gates 74VHCT86ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCT86ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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