Loading...

74VHCT373ATTR

STMicroelectronics

74VHCT373ATTR by STMicroelectronics

74VHCT373ATTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 14.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and features a compact SOIC package. This device supports true output polarity and is suitable for military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,347

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Anansix

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

-

-

-

-

Digiode

USA . 1,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,325 parts In-Stock

1+ parts

$8.929

100+ parts

-

1k+ parts

$8.572

10k+ parts

$8.572

1,325

$8.929

-

$8.572

$8.572

IDEA Electronic Components Group

UK . 20 parts In-Stock

1+ parts

$9.921

100+ parts

-

1k+ parts

$8.929

10k+ parts

-

20

$9.921

-

$8.929

-

AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$12.690

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$12.690

-

-

-

Corohmni

South Africa . 506 parts In-Stock

1+ parts

$15.573

100+ parts

-

1k+ parts

-

10k+ parts

-

506

$15.573

-

-

-

MKK Technologies

India . 1,628 parts In-Stock

1+ parts

$18.656

100+ parts

-

1k+ parts

-

10k+ parts

-

1,628

$18.656

-

-

-

DigiPath Technology Company

USA . 1,628 parts In-Stock

1+ parts

$18.656

100+ parts

-

1k+ parts

-

10k+ parts

-

1,628

$18.656

-

-

-

Native Components

USA . 655 parts In-Stock

1+ parts

$38.590

100+ parts

-

1k+ parts

-

10k+ parts

$37.046

655

$38.590

-

-

$37.046

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$38.864

100+ parts

$35.366

1k+ parts

$31.868

10k+ parts

-

200

$38.864

$35.366

$31.868

-

Northwest PG Solutions

USA . 2,161 parts In-Stock

1+ parts

$42.449

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$42.449

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,563

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,507

-

-

-

-

Microchip USA

USA . 5,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,961

-

-

-

-

Corphita

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,305

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Parana Technologies

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$11.862

1k+ parts

-

10k+ parts

-

120

-

$11.862

-

-

Overview

Elevate your designs with the 74VHCT373ATTR from STMicroelectronics, a pinnacle of quality in bus drivers and transceivers. Renowned for reliability, STMicroelectronics ensures this component delivers exceptional performance, boasting rapid propagation delays and versatile applications across automotive and industrial sectors. Experience seamless integration, robust operation, and peace of mind knowing you’re backed by a trusted manufacturer dedicated to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental factors.

Propagation Delay At Nominal Supply: 14.5 ns

With a low propagation delay, this device enables high-speed data transmission, making it ideal for fast applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards.

No. of Bits: 8

An 8-bit configuration allows for effective data handling in a variety of applications requiring moderate data width.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5V supply makes it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

A low load capacitance indicates reduced power consumption and faster switching speeds.

Power Supplies (V): 5

Single power supply requirement simplifies the design and reduces system complexity.

No. of Terminals: 20

With 20 terminals, it offers a sufficient number of connections for flexible configuration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design offer space-saving solutions for compact electronic assemblies.

Maximum I (ol): 8 Amp

Supports high output current capability, making it suitable for driving loads effectively.

Propagation Delay (tpd): 14.5 ns

Consistent propagation delay ensures reliable timing performance across multiple data streams.

Maximum Operating Temperature: 125 °C

Able to operate in high-temperature environments, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output offers flexibility in multi-device communication, reducing bus contention risks.

Minimum Operating Temperature: -55 °C

With an extended operating temperature range, it is suitable for extreme conditions, such as aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility for PCB layout and assembly.

No. of Ports: 2

Two ports allow for versatile interfacing options in multi-device environments.

Maximum Seated Height: 1.2 mm

A low seated height aids in achieving a sleek and low-profile design in modern electronics.

Width: 4.4 mm

Narrow width enables efficient space management on circuit boards.

Output Polarity: TRUE

True output polarity ensures consistent signal integrity throughout data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in minimum supply voltage enhances compatibility with various systems.

Length: 6.5 mm

Compact dimensions contribute to space-saving designs and easier installation in dense layouts.

Temperature Grade: MILITARY

Military grade specification ensures reliability and performance in hostile environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easier soldering processes and reliable mechanical stability.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated assembly process.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for increased density in PCB design, making it suitable for modern electronics.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a maximum supply voltage of 5.5V provides a safety margin, enhancing reliability.

Technical Specifications

Bus Driver & Transceivers 74VHCT373ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCT373ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20