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74VHCT240AMTR

STMicroelectronics

74VHCT240AMTR by STMicroelectronics

74VHCT240AMTR by STMicroelectronics is a CMOS bus driver with a 9.5 ns propagation delay and operates at a nominal voltage of 5V. It features dual 3-state outputs, ideal for driving high-speed data lines in military applications. With a compact SO package, it supports up to 8A output current.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 7,177 parts In-Stock

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Digiode

USA . 2,384 parts In-Stock

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Anansix

USA . 1,345 parts In-Stock

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Andel Nordic

Denmark . 1,469 parts In-Stock

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$1.234

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$1.184

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$1.184

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Native Components

USA . 212 parts In-Stock

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$1.433

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Northwest PG Solutions

USA . 1,740 parts In-Stock

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$1.576

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$1.576

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IDEA Electronic Components Group

UK . 717 parts In-Stock

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$12.644

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$11.380

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717

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$11.380

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AZTECH Wire

Italy . 893 parts In-Stock

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$14.650

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MKK Technologies

India . 380 parts In-Stock

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$23.777

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DigiPath Technology Company

USA . 380 parts In-Stock

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$23.777

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Microchip USA

USA . 7,959 parts In-Stock

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Parana Technologies

USA . 2,165 parts In-Stock

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$15.118

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Corphita

USA . 1,581 parts In-Stock

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Overview

Unlock unparalleled performance with the 74VHCT240AMTR from STMicroelectronics—your go-to solution for bus driving and transceiving needs. Renowned for their uncompromising quality, STMicroelectronics ensures reliability and precision, making this component perfect for mission-critical applications. Benefit from fast switching speeds and robust temperature tolerances that enhance your designs, empowering innovation and efficiency in every project. Elevate your electronic endeavors with this exceptional product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and protection against environmental factors.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay allows for fast data transmission, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount capability enables efficient and compact PCB design, suitable for modern electronics.

No. of Functions: 2

With two functions, it offers versatility and can perform multiple tasks, reducing the need for extra components.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space utilization, enhancing design efficiency.

No. of Bits: 4

The 4-bit capacity allows support for small data transfers, perfect for low-bandwidth applications.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V operation makes it compatible with most digital systems and easy to integrate.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures a well-balanced performance in terms of speed and power consumption.

Power Supplies (V): 5

Single supply voltage simplifies circuit design and reduces power management complexity.

No. of Terminals: 20

With 20 terminals, this bus driver provides ample connectivity options for complex systems.

Package Style (Meter): SMALL OUTLINE

Small outline package contributes to a compact design, enhancing the overall footprint of the product.

Maximum I (ol): 8 Amp

Capable of handling up to 8 Amps allows for robust performance in demanding applications.

Propagation Delay (tpd): 9.5 ns

Matching the nominal propagation delay, it ensures consistent performance under various conditions.

Maximum Operating Temperature: 125 °C

High operational temperature range makes it suitable for challenging environments and military applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in signal management, allowing for efficient bus utilization.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliability in extreme cold environments, ideal for military use.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances the durability and conductivity of connections, ensuring a stable performance.

Terminal Position: DUAL

Dual terminal positioning enables easier board layout and improved signal integrity.

No. of Ports: 2

Two ports increase versatility in connectivity, allowing for multi-device interfacing.

Maximum Seated Height: 2.65 mm

Low seated height is beneficial for applications requiring low-profile components.

Width: 7.5 mm

Compact width aids in tight PCB layouts and contributes to the overall miniaturization of devices.

Output Polarity: INVERTED

Inverted output polarity can simplify logic circuit designs depending on application requirements.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5 V makes it versatile for various power supply configurations.

Length: 12.8 mm

Compact length facilitates easy integration into small form-factor designs.

Temperature Grade: MILITARY

Military temperature grading ensures reliability and performance in extreme conditions.

Technology: CMOS

CMOS technology offers lower power consumption, maximizing battery life and efficiency.

Terminal Form: GULL WING

Gull wing terminals ensure excellent solder joint reliability and ease of mounting on PCB.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, improving scalability and efficiency.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch is ideal for many layouts, allowing compatibility with various PCB designs.

Control Type: ENABLE LOW

Low-enable control type simplifies system design, ensuring straightforward integration into existing circuits.

Maximum Supply Voltage (Vsup): 5.5 V

Capacity to handle a maximum of 5.5 V provides a buffer for supply variations, enhancing reliability.

Technical Specifications

Bus Driver & Transceivers 74VHCT240AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74VHCT240AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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