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74VHC74TTR

STMicroelectronics

74VHC74TTR by STMicroelectronics

74VHC74TTR by STMicroelectronics is a dual positive edge-triggered flip-flop with a propagation delay of 10.5 ns and operates at supply voltages from 2V to 5.5V. It features a compact SOIC package, ideal for high-speed digital applications. With a max frequency of 75 MHz, it's perfect for data storage and synchronization tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,633 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Atlantic Semiconductor

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 1,996 parts In-Stock

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1,996

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Digiode

USA . 116 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$9.320

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660

$9.320

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IDEA Electronic Components Group

UK . 879 parts In-Stock

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$30.007

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$27.006

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879

$30.007

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$27.006

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Microchip USA

USA . 276 parts In-Stock

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$31.583

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276

$31.583

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MKK Technologies

India . 1,866 parts In-Stock

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$56.426

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DigiPath Technology Company

USA . 1,866 parts In-Stock

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$56.426

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$56.426

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Perfect Parts

USA . 16,872 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Cyclops Electronics Ltd (Excess)

UK . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,324 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 2,547 parts In-Stock

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Parana Technologies

USA . 1,897 parts In-Stock

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$35.878

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$35.878

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Northwest PG Solutions

USA . 1,253 parts In-Stock

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Native Components

USA . 148 parts In-Stock

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148

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Overview

Unlock unparalleled performance with the 74VHC74TTR from STMicroelectronics! This top-tier latch and flip-flop solution offers exceptional speed and reliability, making it ideal for a wide range of applications—from consumer electronics to industrial automation. With STMicroelectronics' commitment to quality and innovation, you can trust this robust device to enhance your designs and deliver lasting value. Choose the 74VHC74TTR for superior efficiency and performance in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body offers durability and resistance to moisture, enhancing the longevity of the product.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures high-speed performance, making this latch and flip-flop suitable for high-frequency applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient automated assembly processes.

No. of Functions: 2

With two functions available, this component provides versatility for various applications without needing multiple devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into circuits with space-efficient layout designs.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3V is suitable for modern digital circuits, ensuring compatibility with low-power systems.

Load Capacitance (CL): 50 pF

A low load capacitance means reduced signal delay and increased speed, making it ideal for high-performance applications.

Power Supplies (V): 2/5.5 V

The ability to operate with a wide range of power supplies allows for versatility in different design environments.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for designs requiring multiple input and output channels.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style enables space-saving designs critical for compact electronic devices, enhancing overall layout flexibility.

Maximum I (ol): 8 Amp

Support for up to 8 Amps allows the latch to manage larger loads, making it suitable for robust applications.

Propagation Delay (tpd): 17.5 ns

This additional propagation delay specification offers reliable performance in various timing-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in demanding environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger enables precise synchronization in timing applications, ensuring accurate data handling.

Minimum Operating Temperature: -55 °C

The capability to operate at extremely low temperatures makes this product ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances solderability and corrosion resistance, promoting dependable connections.

Terminal Position: DUAL

Dual terminal positioning contributes to flexible layout designs and simplified routing on printed circuit boards (PCBs).

Maximum Seated Height: 1.2 mm

A low maximum seated height supports higher density designs, essential for space-critical applications.

Width: 4.4 mm

The compact width allows for efficient use of board space, making it easier to design multi-layer PCBs.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides versatility in signal conditions, important for various digital applications.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V enables operation in lower power applications, contributing to energy efficiency.

Length: 5 mm

A short length enhances design flexibility and space optimization on PCBs.

Temperature Grade: MILITARY

Rated for military applications, this temperature grade signifies reliability and robustness under extreme conditions.

Maximum Frequency At Nominal Supply: 75000000 Hz

High frequency capability supports high-speed data transmission, essential for modern fast-paced digital circuits.

Technology: CMOS

Utilizing CMOS technology provides high noise immunity and low static power consumption, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy surface mounting, making assembly processes more efficient while maximizing reliability.

Packing Method: TR

Through-hole packaging enhances flexibility in circuit design and increases compatibility with various board layouts.

Terminal Pitch: 0.65 mm

The terminal pitch allows for more compact PCB designs by reducing the distance between terminals.

Minimum fmax: 110 MHz

A minimum frequency of 110 MHz indicates high-speed operation, fulfilling the requirements for fast signal processing.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate at a maximum supply voltage of 5.5V gives users flexibility in choosing power supply sources.

Technical Specifications

Latches & Flip-Flops 74VHC74TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

74VHC74TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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