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74VHC574MTR

STMicroelectronics

74VHC574MTR by STMicroelectronics

74VHC574MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 12 ns, operating at a supply voltage of 3.3 V. It features a compact SO package and supports true output polarity for efficient data transmission. Ideal for high-speed applications, it operates up to 75 MHz in extreme temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,696 parts In-Stock

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Digiode

USA . 2,735 parts In-Stock

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Anansix

USA . 2,218 parts In-Stock

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Prism Electronics

USA . 43 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 451 parts In-Stock

1+ parts

$6.174

100+ parts

-

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$5.927

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$5.927

451

$6.174

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$5.927

$5.927

IDEA Electronic Components Group

UK . 1,426 parts In-Stock

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$14.130

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$12.717

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$14.130

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$12.717

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AZTECH Wire

Italy . 1,063 parts In-Stock

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$19.620

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$19.620

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Microchip USA

USA . 295 parts In-Stock

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$20.410

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$20.410

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$20.410

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$20.410

295

$20.410

$20.410

$20.410

$20.410

MKK Technologies

India . 577 parts In-Stock

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$26.571

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DigiPath Technology Company

USA . 577 parts In-Stock

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$26.571

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Component Stockers USA

USA . 701 parts In-Stock

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$99.990

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$99.990

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Native Components

USA . 555 parts In-Stock

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$189.461

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$181.882

555

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Northwest PG Solutions

USA . 1,575 parts In-Stock

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$208.407

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Lixinc

USA . 17,496 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 912 parts In-Stock

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$16.895

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Corphita

USA . 113 parts In-Stock

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Perfect Parts

USA . 48 parts In-Stock

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Overview

Elevate your designs with the 74VHC574MTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance 8-bit bus driver delivers exceptional speed and reliability for a wide range of applications, from automotive to industrial automation. With its compact design and low power consumption, it ensures seamless integration and optimal efficiency. Experience quality and performance that empower your projects—choose STMicroelectronics for unparalleled value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material choice ensures reliable performance under various conditions, suitable for different applications.

Propagation Delay At Nominal Supply: 12 ns

A low propagation delay enhances the speed of data transfer, making this device ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and simpler manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various circuit layouts.

No. of Bits: 8

An 8-bit architecture is effective for handling a combination of data rates and enhances overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply is compatible with modern low-power digital circuits, ensuring energy efficiency.

Load Capacitance (CL): 50 pF

A low load capacitance supports high-speed operation without significant delays.

Power Supplies (V): 2/5.5

A flexible power supply range allows for versatile application across different circuit designs.

No. of Terminals: 20

Twenty terminals provide ample connection options for complex circuitry, enhancing integration potential.

Package Style (Meter): SMALL OUTLINE

The small outline package helps save PCB space while offering high performance.

Maximum I (ol): 8 Amp

Supporting up to 8 Amps makes this device suitable for high-current applications.

Propagation Delay (tpd): 19 ns

The short propagation delay ensures quick response times critical for real-time applications.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures increases reliability in harsh environments.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in bus-oriented systems, permitting connection to multiple devices.

Trigger Type: POSITIVE EDGE

Positive edge triggering facilitates synchronization with other digital circuits for accurate timing.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures functionality even in extreme environments, pertinent for military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish offers superior corrosion resistance, improving longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout configurations on PCBs.

No. of Ports: 2

Two ports enable connection to multiple data lines, enhancing data flow and system flexibility.

Maximum Seated Height: 2.65 mm

A low seated height is conducive for low-profile designs and compact assemblies.

Width: 7.5 mm

The compact width allows for efficient use of space on the PCB, critical in dense layouts.

Output Polarity: TRUE

True output polarity ensures compatibility with a wide range of digital circuits.

Minimum Supply Voltage (Vsup): 2 V

Starting operation at 2V caters to low-power applications, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Support for 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows for robust soldering processes, essential for reliable assembly.

Length: 12.8 mm

The short length enhances space utilization on PCBs, important for compact designs.

Temperature Grade: MILITARY

Military-grade specifications ensure durability and reliability in extreme conditions, making it suitable for defense applications.

Maximum Frequency At Nominal Supply: 75000000 Hz

High maximum frequency capability allows for rapid data transmission, ideal for performance-sensitive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability in the circuit.

Packing Method: TR

Tape and reel packing simplifies automated placement during manufacturing, enhancing production efficiency.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch is a common specification that ensures compatibility with a variety of PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, suitable for standard handling and assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V accommodates various power supply designs, enhancing application versatility.

Technical Specifications

Bus Driver & Transceivers 74VHC574MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74VHC574MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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