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74VHC245MTR

STMicroelectronics

74VHC245MTR by STMicroelectronics

74VHC245MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.5 ns, operating b/w 2-5.5 V. It features a compact SO package and supports bidirectional data transfer, making it ideal for high-speed communication in digital circuits. With military-grade reliability, it operates from -55 °C to 125°C.

Median Price

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6

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1k+

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Vyrian

USA . 8,314 parts In-Stock

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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Digiode

USA . 4,743 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 786 parts In-Stock

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ComSIT Distribution GmbH

Germany . 452 parts In-Stock

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Anansix

USA . 119 parts In-Stock

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Native Components

USA . 249 parts In-Stock

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$0.580

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Northwest PG Solutions

USA . 436 parts In-Stock

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$0.638

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Microchip USA

USA . 381 parts In-Stock

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$14.501

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AZTECH Wire

Italy . 636 parts In-Stock

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$21.240

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IDEA Electronic Components Group

UK . 494 parts In-Stock

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$30.799

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$27.719

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MKK Technologies

India . 136 parts In-Stock

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$57.915

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DigiPath Technology Company

USA . 136 parts In-Stock

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Component Stockers USA

USA . 547 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 7,301 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 2,069 parts In-Stock

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$36.825

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Corphita

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Cyclops Electronics Ltd (Excess)

UK . 786 parts In-Stock

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Glotronic Ltd.

UK . 629 parts In-Stock

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Overview

Unlock superior performance with the 74VHC245MTR from STMicroelectronics, a leader in innovative electronics. This robust bus driver and transceiver ensures fast, reliable data transfer while saving space on your PCB. With its flexible voltage range and military-grade reliability, it's perfect for automotive, industrial, and communication applications. Elevate your designs with exceptional quality, efficiency, and the trusted expertise of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay enhances the speed and efficiency of data transmission, making it suitable for high-performance applications.

Surface Mount: YES

Surface mount technology allows for compact design and improved PCB space efficiency.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient layout on PCBs, facilitating easier integration.

No. of Bits: 8

An 8-bit configuration allows for substantial data handling capacity, perfect for digital communication applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is ideal for low-power applications, making it energy-efficient.

Load Capacitance (CL): 50 pF

A low load capacitance ensures faster switching times, enhancing the overall performance of the bus driver.

Power Supplies (V): 2/5.5

This wide range of power supply voltages offers flexibility and compatibility with various systems.

No. of Terminals: 20

Having 20 terminals provides more connectivity options, making it versatile for different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, useful in compact electronics.

Maximum I (ol): 8 Amp

Capable of handling up to 8 Amps, this component can manage high current loads effectively, great for demanding applications.

Propagation Delay (tpd): 13.5 ns

A propagation delay of 13.5 ns allows for efficient data processing, suitable for fast-paced applications.

Maximum Operating Temperature: 125 °C

This high operational temperature gives the component reliability in harsh environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus applications, enabling sharing of lines efficiently.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliability in extreme conditions, ideal for military or aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish guarantees excellent solderability and corrosion resistance for enhanced longevity.

Terminal Position: DUAL

Dual terminal positioning aids in better layout designs and can improve signal integrity.

No. of Ports: 2

Two ports allow for simultaneous input/output operations, enhancing capability in data communication.

Maximum Seated Height: 2.65 mm

A low seated height keeps the component compact, suitable for space-constrained applications.

Width: 7.5 mm

This width factor aids in easy placement on PCBs without excessive disruption to layout designs.

Output Polarity: TRUE

Output polarity being true helps maintain logical consistency in data transmission.

Minimum Supply Voltage (Vsup): 2 V

Lower minimum supply voltage allows compatibility with various low-voltage systems, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30s, this product supports efficient soldering processes without damage.

Peak Reflow Temperature °C: 260

A high peak reflow temperature is suitable for lead-free soldering processes, aligning with modern manufacturing practices.

Length: 12.8 mm

A compact length allows for ease of integration into tight circuit board layouts.

Temperature Grade: MILITARY

Designed to military standards, ensuring reliability and performance in critical applications.

Technology: CMOS

CMOS technology is well-known for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull-wing terminals are beneficial for high-yield soldering techniques and support automated production.

Packing Method: TR

The TR packing method facilitates easy handling and automated assembly, boosting production efficiency.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compatibility with a variety of PCB designs and assembly machines.

Count Direction: BIDIRECTIONAL

Bidirectional data transfer allows for flexible configuration in various applications.

Control Type: COMMON CONTROL

Common control functionality simplifies design and increases reliability in data processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable handling requirements, contributing to its robustness in different environments.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for use in both low and moderate voltage applications.

Technical Specifications

Bus Driver & Transceivers 74VHC245MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHC245MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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