Loading...

74VHC16373TTR

STMicroelectronics

74VHC16373TTR by STMicroelectronics

74VHC16373TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 10.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 3.3V and supports dual ports in a compact SOIC package. This device is perfect for military-grade electronics due to its wide temperature range (-55 °C to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,527

-

-

-

-

Anansix

USA . 1,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,597

-

-

-

-

Digiode

USA . 1,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,168 parts In-Stock

1+ parts

$2.223

100+ parts

-

1k+ parts

$2.134

10k+ parts

$2.134

2,168

$2.223

-

$2.134

$2.134

Microchip USA

USA . 452 parts In-Stock

1+ parts

$14.153

100+ parts

-

1k+ parts

-

10k+ parts

-

452

$14.153

-

-

-

AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$17.880

100+ parts

-

1k+ parts

-

10k+ parts

-

563

$17.880

-

-

-

IDEA Electronic Components Group

UK . 1,490 parts In-Stock

1+ parts

$23.014

100+ parts

-

1k+ parts

$20.712

10k+ parts

-

1,490

$23.014

-

$20.712

-

MKK Technologies

India . 2,119 parts In-Stock

1+ parts

$43.276

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$43.276

-

-

-

DigiPath Technology Company

USA . 2,119 parts In-Stock

1+ parts

$43.276

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$43.276

-

-

-

Corphita

USA . 3,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,636

-

-

-

-

Northwest PG Solutions

USA . 2,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,195

-

-

-

-

Native Components

USA . 952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

952

-

-

-

-

Parana Technologies

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$27.516

1k+ parts

-

10k+ parts

-

30

-

$27.516

-

-

Overview

Unlock the potential of your designs with the 74VHC16373TTR from STMicroelectronics—a trusted leader in quality and innovation. This versatile bus driver and transceiver enhances performance with its ultra-fast propagation delay and robust thermal resilience, making it ideal for demanding applications. Enjoy reliable connectivity and seamless integration, all while benefiting from ST's commitment to excellence that ensures your projects are built to last. Embrace superior technology and elevate your engineering projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed communication needs.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier assembly, making it ideal for modern electronics.

No. of Functions: 2

Having multiple functions contributes to circuit efficiency by reducing the number of required components.

Package Shape: RECTANGULAR

A rectangular package shape aids in space optimization on PCBs, enhancing design flexibility.

No. of Bits: 8

An 8-bit configuration allows for robust data handling, suitable for a wide range of digital applications.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes it compatible with the majority of modern digital systems.

Load Capacitance (CL): 50 pF

A low load capacitance enables faster switching times, enhancing performance in high-speed applications.

Power Supplies (V): 2/5.5

The wide range of acceptable power supply voltages provides flexibility for integration with different systems.

No. of Terminals: 48

A higher number of terminals allows for more connections, accommodating complex circuits and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This packaging style is optimized for high-density layouts, making it suitable for space-constrained designs.

Maximum I (ol): 8 Amp

With a maximum output current of 8 A, this product can drive heavy loads, making it versatile for various use cases.

Propagation Delay (tpd): 16.5 ns

A short propagation delay ensures minimal latency in signal transmission, which is crucial for high-performance systems.

Maximum Operating Temperature: 125 °C

This high operating temperature rating allows it to function in demanding environments, increasing reliability.

Output Characteristics: 3-STATE

3-state output capabilities enhance bus-sharing functionality, making it versatile for multi-device configurations.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this device suitable for applications in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible layout arrangements on PCBs.

No. of Ports: 2

Having two ports enables connection capabilities across multiple lines, facilitating complex circuit designs.

Maximum Seated Height: 1.2 mm

A low seated height ensures that the component will fit well in low-profile designs.

Width: 6.1 mm

This compact width allows the component to fit into tight spaces, making it versatile for various electronic designs.

Output Polarity: TRUE

True output polarity ensures proper integration with other digital logic components, maintaining signal integrity.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage requirement makes this product highly adaptable across various voltage levels.

Length: 12.5 mm

The compact length of 12.5 mm ensures it can fit conveniently in space-restricted applications.

Temperature Grade: MILITARY

The military grade temperature specification indicates high reliability and suitability for critical applications.

Technology: CMOS

Using CMOS technology provides advantages in low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a reliable connection to the PCB for enhanced performance.

Packing Method: TR

Tape and reel packing method allows for efficient handling and automated assembly processes in manufacturing.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm enables high-density placements and supports modern compact layout designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of devices and applications.

Technical Specifications

Bus Driver & Transceivers 74VHC16373TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VHC16373TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20