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74VHC16244TTR

STMicroelectronics

74VHC16244TTR by STMicroelectronics

74VHC16244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 9 ns, supporting dual ports and operating b/w 2-5.5 V. Its compact design features a thin profile and operates in extreme temperatures from -55 °C to 125 °C. Ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,670 parts In-Stock

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2,670

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Digiode

USA . 2,493 parts In-Stock

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2,493

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Vyrian

USA . 2,210 parts In-Stock

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2,210

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Microchip USA

USA . 372 parts In-Stock

1+ parts

$8.537

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-

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372

$8.537

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Andel Nordic

Denmark . 5,603 parts In-Stock

1+ parts

$9.324

100+ parts

-

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$8.951

10k+ parts

$8.951

5,603

$9.324

-

$8.951

$8.951

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$12.081

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141

$12.081

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$16.145

100+ parts

$14.692

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$13.239

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50

$16.145

$14.692

$13.239

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AZTECH Wire

Italy . 161 parts In-Stock

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$21.160

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161

$21.160

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

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$25.177

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$22.659

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2,088

$25.177

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$22.659

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MKK Technologies

India . 1,148 parts In-Stock

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$47.343

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$47.343

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DigiPath Technology Company

USA . 1,148 parts In-Stock

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$47.343

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1,148

$47.343

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Component Stockers USA

USA . 212 parts In-Stock

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$99.990

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212

$99.990

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Kepictronics

USA . 1,247 parts In-Stock

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Parana Technologies

USA . 396 parts In-Stock

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$30.103

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396

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$30.103

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Northwest PG Solutions

USA . 214 parts In-Stock

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Native Components

USA . 175 parts In-Stock

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175

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Corphita

USA . 50 parts In-Stock

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50

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Overview

Elevate your designs with the 74VHC16244TTR from STMicroelectronics—a premium bus driver and transceiver offering unmatched reliability and performance. With rapid propagation delay and robust temperature tolerance, this component thrives in demanding applications, ensuring seamless data transfer across your systems. STMicroelectronics' commitment to quality and innovation guarantees you a powerful solution that enhances efficiency and longevity, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and thermal resistance, ensuring reliable performance in various environments.

Propagation Delay At Nominal Supply: 9 ns

A fast propagation delay enhances the responsiveness of the bus driver, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of PCB assembly, saving space and time in manufacturing.

No. of Functions: 4

Multiple functions in a single package reduce component count and simplify the design process, lowering overall costs.

Package Shape: RECTANGULAR

A rectangular shape optimizes layout efficiency on PCBs, facilitating better space utilization in electronic designs.

No. of Bits: 4

A 4-bit capability allows for versatile applications in digital logic systems, providing flexibility for various designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V supports low-power applications, making it ideal for battery-operated devices.

Power Supplies (V): 2/5.5

The ability to operate across a wide voltage range (2 to 5.5V) makes this product adaptable to different systems and requirements.

No. of Terminals: 48

A high number of terminals allows for more complex interconnections and greater flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile optimize space, making it suitable for modern compact electronic designs.

Maximum I (ol): 8 Amp

Supporting a maximum output current of 8A makes it suitable for driving stronger loads, enhancing its usefulness in demanding applications.

Propagation Delay (tpd): 13.5 ns

The additional propagation delay specification shows consistent performance, suitable for timing-critical applications.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in harsh environments, making it ideal for military and industrial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus configurations, allowing multiple devices to share the same communication lines.

Minimum Operating Temperature: -55 °C

Capable of functioning in low temperatures, this product is suitable for applications in extreme conditions, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent solderability and corrosion resistance, improving the reliability of connections.

Terminal Position: DUAL

Dual terminal position provides options for layout configurations, enhancing design flexibility for engineers.

No. of Ports: 2

Having two ports allows for interfacing between multiple devices, adding to the versatility of the bus driver.

Maximum Seated Height: 1.2 mm

The low seated height contributes to low-profile designs, which is beneficial for compact spaces in electronic systems.

Width: 6.1 mm

A narrow width allows for space-efficient layouts, catering to applications where PCB real estate is limited.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, making integration straightforward in digital systems.

Minimum Supply Voltage (Vsup): 2 V

Flexible minimum supply voltage makes this product usable in low-power applications, extending its usability across various designs.

Length: 12.5 mm

A moderate length contributes to the compact form factor, making it suitable for miniaturized electronic designs.

Temperature Grade: MILITARY

The military-grade temperature specifications indicate reliability and robustness, meeting stringent requirements for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for portable and battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the robustness of the connections in assemblies.

Packing Method: TR

The tape and reel packing method simplifies inventory management and automation in the manufacturing process.

Terminal Pitch: 0.5 mm

A fine terminal pitch reduces space on the PCB, accommodating more functionality in a smaller area.

Control Type: ENABLE LOW

Low enable control simplifies interfacing with other logic levels, providing ease of integration in various circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V extends the operating range, allowing for flexibility in powering the device.

Technical Specifications

Bus Driver & Transceivers 74VHC16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VHC16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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