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74VHC08TTR

STMicroelectronics

74VHC08TTR by STMicroelectronics

74VHC08TTR by STMicroelectronics is a logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 3.3V, has a propagation delay of 9ns, and can handle load capacitance up to 50pF. This CMOS technology device is suitable for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.612

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 117 parts In-Stock

1+ parts

$0.612

100+ parts

$0.643

1k+ parts

$0.606

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117

$0.612

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$0.606

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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Digiode

USA . 4,831 parts In-Stock

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Chip Stock

USA . 4,085 parts In-Stock

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Vyrian

USA . 3,752 parts In-Stock

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Anansix

USA . 617 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 460 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 158 parts In-Stock

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$7.165

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AZTECH Wire

Italy . 717 parts In-Stock

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$10.260

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717

$10.260

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IDEA Electronic Components Group

UK . 1,948 parts In-Stock

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$24.685

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$22.217

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$24.685

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Ampacity Inc.

Singapore . 945 parts In-Stock

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$26.000

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Native Components

USA . 758 parts In-Stock

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$28.976

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Northwest PG Solutions

USA . 2,230 parts In-Stock

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$31.874

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$28.687

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$28.687

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MKK Technologies

India . 1,107 parts In-Stock

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$46.419

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$46.419

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DigiPath Technology Company

USA . 1,107 parts In-Stock

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$46.419

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Corphita

USA . 4,155 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 263 parts In-Stock

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$29.515

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Overview

Unlock the power of advanced logic gates with the 74VHC08TTR by STMicroelectronics. Crafted with precision and expertise, this product boasts top-notch quality and reliability. Ideal for a wide range of applications, this logic gate offers lightning-fast technology to enhance your projects. With an emphasis on value and performance, this product provides customers with the advantage of efficient operation and seamless integration. Elevate your designs with the 74VHC08TTR and experience unparalleled benefits that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easy to handle and install.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components and simplifies circuit design.

No. of Inputs: 2

Having 2 inputs provides flexibility in performing logical operations, making the product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes the product compatible with standard voltage levels commonly used in electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and performance in various circuit conditions.

Power Supplies (V): 2/5.5

Support for a wide range of power supplies (2V to 5.5V) offers compatibility with different system configurations.

No. of Terminals: 14

Having 14 terminals allows for easy connections and interfaces with other components or circuits.

Maximum I (ol): 8 Amp

High output current capability (8A) ensures the product can drive loads efficiently without overheating or voltage drop.

Propagation Delay (tpd): 14 ns

Although slightly higher than nominal, the propagation delay of 14ns is still fast enough for most applications requiring quick signal processing.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand elevated temperatures in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable performance even in cold conditions or when subjected to temperature variations.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and allows for better orientation during assembly.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm saves space and allows for compact designs when integrating the product into electronic systems.

Width: 4.4 mm

Compact width of 4.4mm makes the product suitable for applications where board space is limited.

Minimum Supply Voltage (Vsup): 2 V

Support for a minimum supply voltage of 2V ensures operation in low-power scenarios or when voltage levels are limited.

Length: 5 mm

The small length of 5mm further contributes to the compact size of the product, making it ideal for space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature range ensures the product can operate reliably in extreme temperature conditions without failure.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the product's overall performance.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring robust connections.

Packing Method: TR

Tape and reel packing method simplifies storage, handling, and automated assembly of the product, improving production efficiency.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for densely packed connections on circuit boards, enabling high integration density.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the product can handle higher voltages without compromising performance or reliability.

Technical Specifications

Logic Gates 74VHC08TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC08TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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