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74VHC00MTR

STMicroelectronics

74VHC00MTR by STMicroelectronics

74VHC00MTR by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 8.5 ns at 3.3V, suitable for military-grade applications due to its wide operating temperature range of -55 °C to 125°C. This surface-mount package features a small outline design with dual-position terminals, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,979 parts In-Stock

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Pegasus Components GmbH

Germany . 7,500 parts In-Stock

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7,500

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Digiode

USA . 4,533 parts In-Stock

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Anansix

USA . 2,008 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 287 parts In-Stock

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$1.277

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287

$1.277

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Northwest PG Solutions

USA . 1,347 parts In-Stock

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$1.405

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$1.405

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AZTECH Wire

Italy . 1,140 parts In-Stock

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$14.900

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$14.900

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IDEA Electronic Components Group

UK . 890 parts In-Stock

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$22.431

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$20.188

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890

$22.431

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MKK Technologies

India . 240 parts In-Stock

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$42.181

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DigiPath Technology Company

USA . 240 parts In-Stock

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$42.181

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Microchip USA

USA . 196 parts In-Stock

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$86.950

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$86.950

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$86.950

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$86.950

196

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$86.950

Corphita

USA . 3,580 parts In-Stock

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Parana Technologies

USA . 985 parts In-Stock

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$26.820

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Overview

Unlock the power of efficient logic gates with the 74VHC00MTR by STMicroelectronics. Crafted with precision and quality, this product offers unparalleled performance in a compact package. Ideal for a variety of applications, this logic gate ensures fast propagation delay and low power consumption, making it a valuable asset for any project. Trust in STMicroelectronics to deliver reliability and innovation, allowing you to bring your designs to life with ease. Choose the 74VHC00MTR for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside the package, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay allows for fast signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easy and efficient, saving space and enabling automated assembly processes.

No. of Functions: 4

Having multiple functions in a single package increases versatility and flexibility for different circuit design requirements.

No. of Inputs: 2

Having two inputs allows for basic logic operations, making it suitable for simple gate applications in digital circuits.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard digital systems and reduces power consumption.

Load Capacitance (CL): 50 pF

Suitable load capacitance enables efficient signal transmission and reception in digital circuits, reducing signal distortion and ensuring reliable operation.

Power Supplies (V): 2/5.5

Wide range of power supply voltages (2V to 5.5V) allows for flexibility in different application scenarios, accommodating various system requirements.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Temperature Grade: MILITARY

Military-grade temperature handling capability ensures reliable operation in harsh environmental conditions, making it suitable for aerospace, defense, and industrial applications.

Technical Specifications

Logic Gates 74VHC00MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHC00MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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