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74V1T66STR

STMicroelectronics

74V1T66STR by STMicroelectronics

74V1T66STR by STMicroelectronics is a low-profile CMOS SPST switch with a max operating temp of 125 °C and a nominal voltage of 5V. It features fast switching times (4 ns on, 7.5 ns off) and excellent isolation (60 dB), ideal for compact electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,349 parts In-Stock

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4,349

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Digiode

USA . 1,870 parts In-Stock

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1,870

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Anansix

USA . 947 parts In-Stock

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947

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ACDS - Activité Composants Distribution Service

France . 539 parts In-Stock

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539

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Bristol Electronics

USA . 539 parts In-Stock

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539

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Dan-Mar Components

USA . 539 parts In-Stock

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539

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Distributors (Availability)

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Ampacity Inc.

Singapore . 817 parts In-Stock

1+ parts

$4.500

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-

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817

$4.500

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IDEA Electronic Components Group

UK . 987 parts In-Stock

1+ parts

$11.896

100+ parts

-

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$10.706

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987

$11.896

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$10.706

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AZTECH Wire

Italy . 1,032 parts In-Stock

1+ parts

$18.470

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1,032

$18.470

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MKK Technologies

India . 391 parts In-Stock

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$22.369

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391

$22.369

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DigiPath Technology Company

USA . 391 parts In-Stock

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$22.369

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391

$22.369

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QUARKTWIN TECHNOLOGY LTD

USA . 28,415 parts In-Stock

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Metaverse IC Inc.

Canada . 22,999 parts In-Stock

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Microchip USA

USA . 7,876 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,946 parts In-Stock

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$14.223

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$14.223

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Corphita

USA . 1,608 parts In-Stock

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Perfect Parts

USA . 1,015 parts In-Stock

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1,015

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Native Components

USA . 636 parts In-Stock

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$3.939

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636

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$3.939

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Northwest PG Solutions

USA . 237 parts In-Stock

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$3.980

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237

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$3.980

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Overview

Unlock the power of precision with the 74V1T66STR from STMicroelectronics, a top-tier solution in multiplexers and switches. Crafted with meticulous attention to quality, this low-profile device excels in applications requiring reliable performance under extreme conditions. Offering unmatched durability and efficiency, it seamlessly integrates into your designs, elevating functionality without compromising on space. Experience superior value that drives innovation and success in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, optimizing space in compact electronic designs.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout in circuit boards, improving design flexibility.

Nominal Supply Voltage (Vsup): 5 V

A standard supply voltage of 5 V makes it compatible with a wide range of electronic systems.

Power Supplies (V): 5

Supports a wide variety of 5 V powered devices, enhancing interoperability.

No. of Terminals: 5

Having five terminals allows for versatile configurations in circuit designs, aiding in complex applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design minimizes height, making it ideal for tight spaces in modern electronics.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, providing reliability in demanding scenarios.

Minimum Operating Temperature: -55 °C

An extensive temperature range allows this product to be used in extreme conditions, such as military or aerospace applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring longevity.

Terminal Position: DUAL

Dual terminal positions allow for efficient routing on PCB, enhancing design ease and efficiency.

Maximum Seated Height: 1.45 mm

A low seated height ensures design compatibility with space-constrained applications.

Width: 1.625 mm

A narrow width allows for compact layouts, making it easier to fit multiple components on a single board.

Other IC type: SPST

Single-Pole Single-Throw configuration is versatile for various switching applications.

Minimum Supply Voltage (Vsup): 4.5 V

A lower minimum supply voltage expands the range of devices that can utilize this product.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for flexibility in manufacturing processes, accommodating various reflow soldering techniques.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports compatibility with lead-free soldering standards.

Maximum On-state Resistance (Ron): 10 ohm

Low on-state resistance improves the efficiency of the switch, reducing power losses.

Maximum Switch-on Time: 4 ns

Fast switch-on time enhances the speed of signal processing and switching applications.

Length: 2.9 mm

Compact length facilitates tighter layouts without compromising performance.

Maximum Switch-off Time: 7.5 ns

Quick switch-off time enables high-speed applications, ensuring efficient operation.

Temperature Grade: MILITARY

MILITARY grade ensures higher reliability and durability, making it suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve connection integrity.

Terminal Pitch: 0.95 mm

A tighter terminal pitch allows for more components to be packed into a smaller space.

Maximum Supply Voltage (Vsup): 5.5 V

Provides a higher limit while maintaining compatibility with standard power supplies.

Nominal Off-state Isolation: 60 dB

High isolation ensures minimal interference between channels, enhancing signal integrity.

Technical Specifications

Multiplexers & Switches 74V1T66STR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

60 dB

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

7.5 ns

Maximum Switch-on Time:

4 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.625 mm

Trade Compliance

74V1T66STR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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