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74LVX08TTR

STMicroelectronics

74LVX08TTR by STMicroelectronics

74LVX08TTR from STMicroelectronics is a CMOS logic gate with a propagation delay of 13 ns and operates at a supply voltage of 2.7-3.6 V. It features 4 functions with dual inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures (-55 °C to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,185 parts In-Stock

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7,185

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LIBRA Elektronik GmbH

Germany . 4,819 parts In-Stock

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4,819

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Digiode

USA . 1,742 parts In-Stock

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1,742

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Anansix

USA . 925 parts In-Stock

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925

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Microchip USA

USA . 485 parts In-Stock

1+ parts

$3.074

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485

$3.074

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Ampacity Inc.

Singapore . 1,328 parts In-Stock

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$7.000

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1,328

$7.000

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AZTECH Wire

Italy . 889 parts In-Stock

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$8.110

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889

$8.110

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IDEA Electronic Components Group

UK . 510 parts In-Stock

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$15.884

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$14.295

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510

$15.884

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$14.295

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MKK Technologies

India . 706 parts In-Stock

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$29.868

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706

$29.868

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DigiPath Technology Company

USA . 706 parts In-Stock

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$29.868

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706

$29.868

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Native Components

USA . 262 parts In-Stock

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$139.750

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$134.160

262

$139.750

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$134.160

Northwest PG Solutions

USA . 694 parts In-Stock

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$153.725

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694

$153.725

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Perfect Parts

USA . 29,187 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,646 parts In-Stock

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A-Z Elektronik GmbH

Germany . 15,000 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Corphita

USA . 2,001 parts In-Stock

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Parana Technologies

USA . 1,688 parts In-Stock

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$18.992

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1,688

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$18.992

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Overview

Elevate your designs with the 74LVX08TTR from STMicroelectronics—a pinnacle of reliability and performance in logic gates. Engineered for excellence, this component ensures rapid processing and efficiency, ideal for diverse applications from automotive to industrial control. With STMicroelectronics' commitment to quality and innovation, you gain not just a product but a partnership that enhances your project's success. Experience unmatched versatility and superior temperature resilience, making it the smart choice for demanding environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making this logic gate suitable for a variety of applications.

Propagation Delay At Nominal Supply: 13 ns

A low propagation delay indicates faster performance, making this logic gate ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved circuit density, enhancing board space utilization.

No. of Functions: 4

Multiple functions in a single package provide versatility, allowing for diverse circuit designs without the need for additional components.

No. of Inputs: 2

Having two inputs allows for standard operations such as AND, OR, and NOT, making it a flexible choice for various logic configurations.

Package Shape: RECTANGULAR

A rectangular shape assists in efficient layout design on printed circuit boards, facilitating ease of integration.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal voltage of 2.7V ensures compatibility with a range of low-voltage digital circuits.

Load Capacitance (CL): 50 pF

A lower load capacitance supports faster switching times and reduces power consumption, enhancing overall circuit efficiency.

Power Supplies (V): 3.3

The ability to operate on a 3.3V supply voltage is optimal for modern digital circuit designs, ensuring compatibility with common components.

No. of Terminals: 14

With 14 terminals, this logic gate can accommodate multiple connections, providing more functionality in a single package.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A thin profile saves space in compact electronic designs, ideal for portable and miniaturized applications.

Maximum I (ol): 4 Amp

A high maximum output current capability of 4A allows for driving larger loads, enhancing its applicability in power-intensive circuits.

Propagation Delay (tpd): 18 ns

While slightly higher than the nominal supply delay, this delay still supports rapid switching necessary for reliable digital performance.

Maximum Operating Temperature: 125 °C

High operational temperature tolerances ensure reliability in extreme environments, making this logic gate suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

Ability to function in extremely low temperatures opens applications in harsh environments, such as aerospace and defense.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold plating ensures excellent conductivity and corrosion resistance, enhancing the reliability and lifespan of the connections.

Terminal Position: DUAL

Dual terminal positioning allows for more flexibility in circuit board designs, facilitating easier layout and assembly.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with thin-profile PCB designs, ideal for space-constrained applications.

Width: 4.4 mm

A compact width supports efficient layout and integration into tight spaces, perfect for modern electronics.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V increases the versatility of applications, suitable for various circuits.

Length: 5 mm

Shorter length aids in conserving PCB space while allowing for denser packing of electronic components.

Temperature Grade: MILITARY

Certified for military applications, indicating high reliability and performance under harsh conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly, improving production efficiency.

Packing Method: TR

The tape and reel packing method facilitates easy handling and placement during automated assembly processes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for compact layouts, making this gate a good choice for high-density designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides headroom for voltage fluctuations, enhancing reliability in diverse circuit environments.

Technical Specifications

Logic Gates 74LVX08TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX08TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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