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74LCX574TTR

STMicroelectronics

74LCX574TTR by STMicroelectronics

74LCX574TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 8.5 ns at 3.3V, suitable for applications requiring fast signal transmission. It features a max frequency of 150MHz, operates in a temperature range from -55 °C to 125°C, and has a compact small outline package ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 18,500 parts In-Stock

1+ parts

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18,500

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Vyrian

USA . 8,893 parts In-Stock

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8,893

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ComSIT Distribution GmbH

Germany . 7,500 parts In-Stock

1+ parts

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7,500

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R&J Components

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Digiode

USA . 4,576 parts In-Stock

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4,576

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Anansix

USA . 119 parts In-Stock

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119

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Distributors (Availability)

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Native Components

USA . 79 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

$0.141

79

$0.147

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-

$0.141

Northwest PG Solutions

USA . 1,723 parts In-Stock

1+ parts

$0.162

100+ parts

-

1k+ parts

-

10k+ parts

$0.143

1,723

$0.162

-

-

$0.143

Andel Nordic

Denmark . 951 parts In-Stock

1+ parts

$2.362

100+ parts

-

1k+ parts

$2.268

10k+ parts

$2.268

951

$2.362

-

$2.268

$2.268

Microchip USA

USA . 498 parts In-Stock

1+ parts

$5.156

100+ parts

-

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498

$5.156

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$8.620

100+ parts

-

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$7.758

10k+ parts

-

431

$8.620

-

$7.758

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AZTECH Wire

Italy . 159 parts In-Stock

1+ parts

$9.760

100+ parts

-

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159

$9.760

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MKK Technologies

India . 345 parts In-Stock

1+ parts

$16.210

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345

$16.210

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$16.210

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345

$16.210

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Ampacity Inc.

Singapore . 1,155 parts In-Stock

1+ parts

$53.000

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1,155

$53.000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 18,500 parts In-Stock

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18,500

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Assy Fe

Spain . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,252 parts In-Stock

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3,252

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A-Z Elektronik GmbH

Germany . 2,775 parts In-Stock

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2,775

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Parana Technologies

USA . 1,539 parts In-Stock

1+ parts

-

100+ parts

$10.307

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1,539

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$10.307

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ChipstoGo Electronic ltd

UK . 240 parts In-Stock

1+ parts

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240

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iodParts Technologies Inc.

India . 187 parts In-Stock

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187

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Overview

Boost your projects with the high-quality 74LCX574TTR by STMicroelectronics, a top-tier manufacturer in the industry of Bus Driver & Transceivers. This versatile component is designed to provide seamless communication and efficient signal transmission, ensuring optimal performance for your applications. With a low propagation delay and 3-state output characteristics, this product offers exceptional value and reliability. Upgrade your electronic designs with STMicroelectronics' 74LCX574TTR and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures quick signal transmission, making this bus driver efficient for high-speed data communication.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly process.

No. of Bits: 8

The 8-bit configuration provides sufficient data handling capability for various bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 2.7

This low voltage requirement makes the product energy-efficient and suitable for applications with limited power supply.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions and critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74LCX574TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LCX574TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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