Loading...

74LCX162541TTR

STMicroelectronics

74LCX162541TTR by STMicroelectronics

74LCX162541TTR by STMicroelectronics is a dual 8-bit bus driver with a fast propagation delay of 4.4 ns, operating at a supply voltage of 2.7-3.6 V. It features a compact SOIC package and supports industrial applications with temperatures from -40 °C to 85°C. Ideal for high-speed data transmission in digital circuits, it ensures reliable performance with low load capacitance (50 pF).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

-

-

-

-

Digiode

USA . 1,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,321

-

-

-

-

Anansix

USA . 889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

889

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,609 parts In-Stock

1+ parts

$3.327

100+ parts

-

1k+ parts

$3.194

10k+ parts

$3.194

1,609

$3.327

-

$3.194

$3.194

Native Components

USA . 232 parts In-Stock

1+ parts

$14.020

100+ parts

-

1k+ parts

-

10k+ parts

-

232

$14.020

-

-

-

Northwest PG Solutions

USA . 201 parts In-Stock

1+ parts

$15.422

100+ parts

$13.880

1k+ parts

-

10k+ parts

-

201

$15.422

$13.880

-

-

AZTECH Wire

Italy . 1,146 parts In-Stock

1+ parts

$17.390

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$17.390

-

-

-

IDEA Electronic Components Group

UK . 35 parts In-Stock

1+ parts

$21.002

100+ parts

-

1k+ parts

$18.902

10k+ parts

-

35

$21.002

-

$18.902

-

Microchip USA

USA . 368 parts In-Stock

1+ parts

$36.653

100+ parts

-

1k+ parts

-

10k+ parts

-

368

$36.653

-

-

-

MKK Technologies

India . 1,490 parts In-Stock

1+ parts

$39.492

100+ parts

-

1k+ parts

-

10k+ parts

-

1,490

$39.492

-

-

-

DigiPath Technology Company

USA . 1,490 parts In-Stock

1+ parts

$39.492

100+ parts

-

1k+ parts

-

10k+ parts

-

1,490

$39.492

-

-

-

Perfect Parts

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,100

-

-

-

-

Parana Technologies

USA . 2,009 parts In-Stock

1+ parts

-

100+ parts

$25.111

1k+ parts

-

10k+ parts

-

2,009

-

$25.111

-

-

Corphita

USA . 327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

327

-

-

-

-

Overview

Elevate your design with the 74LCX162541TTR from STMicroelectronics, a cornerstone of innovation in bus drivers and transceivers. Renowned for uncompromising quality, this device ensures lightning-fast signal integrity, making it ideal for high-speed applications across automotive, industrial, and consumer electronics. With exceptional performance and reliability, it empowers engineers to create cutting-edge solutions that stand the test of time. Discover unmatched efficiency and drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances reliability in various environmental conditions, making it suitable for industrial applications.

Propagation Delay At Nominal Supply: 4.4 ns

With a low propagation delay, this product enables faster signal transmission, improving overall system performance.

Surface Mount: YES

Surface mount technology allows for reduced PCB space and improved performance, facilitating easier integration into modern designs.

No. of Functions: 2

Having multiple functions allows for versatility in design, making it a cost-effective option for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout space on the PCB, which is beneficial for compact circuit designs.

No. of Bits: 8

Eight bits offer a balanced performance for data transfer applications, fulfilling many common system requirements.

Nominal Supply Voltage / Vsup: 2.7 V

Works optimally at a nominal supply voltage, contributing to power efficiency and compatibility with low-voltage systems.

Load Capacitance (CL): 50 pF

The specified load capacitance allows for high-speed operation while maintaining signal integrity.

Power Supplies (V): 3.3 V

Supports a standard power supply voltage, which is common in many modern electronic applications, ensuring easy integration.

No. of Terminals: 48

A higher number of terminals provides more connections, enhancing flexibility and usability in complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design allows for high-density board layouts, making it ideal for modern compact electronics.

Maximum I (ol): 12 Amp

With a high maximum output current, this product can drive stronger loads, making it suitable for demanding applications.

Propagation Delay (tpd): 5.6 ns

A relatively low propagation delay contributes to the fast performance necessary for high-speed communication systems.

Maximum Operating Temperature: 85 °C

Rated for operation at elevated temperatures, ensuring reliability in harsh environments typical of industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Provides flexibility in signal management, allowing multiple devices to share the same data bus without conflict.

Minimum Operating Temperature: -40 °C

A wide temperature range makes it suitable for environments exposed to extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves corrosion resistance and contact reliability, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility and simplifies PCB design.

No. of Ports: 2

Two ports facilitate the simultaneous connection to multiple devices, increasing efficiency in communication channels.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for designs requiring low-profile components, supporting space-constrained layouts.

Width: 6.1 mm

The moderate width supports a balance between density and ease of handling during assembly.

Output Polarity: TRUE

True output polarity ensures compatibility with positive signaling systems, important for reliable data communications.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2 V allows for energy efficiency and functionality in low-power applications.

Length: 12.5 mm

The compact length helps maintain a small footprint on the PCB while allowing multiple components to coexist.

Temperature Grade: INDUSTRIAL

Designed for industrial use, it guarantees robustness and reliability in more demanding operating conditions.

Technology: CMOS

CMOS technology provides advantages such as low power consumption and high noise immunity, making it effective for various applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and increase yield during PCB assembly due to their design.

Packing Method: TR

Tape and reel packing ensures efficient handling and ease of use during production processes.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for smaller board designs while maintaining reliable connections.

Control Type: ENABLE LOW

The enable low control type supports straightforward interfacing and control logic in various applications.

Maximum Supply Voltage (Vsup): 3.6 V

A flexible maximum supply voltage accommodates a range of systems while ensuring safety and performance.

Technical Specifications

Bus Driver & Transceivers 74LCX162541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LCX162541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20