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74LCX16240TTR

STMicroelectronics

74LCX16240TTR by STMicroelectronics

74LCX16240TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 4.5 ns, supporting up to 24 A output current. It operates b/w 2-3.6 V and features a compact 48-terminal package. Ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,459 parts In-Stock

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3,459

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Vyrian

USA . 3,142 parts In-Stock

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Anansix

USA . 2,427 parts In-Stock

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2,427

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Distributors (Availability)

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Native Components

USA . 69 parts In-Stock

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$1.490

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69

$1.490

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Northwest PG Solutions

USA . 403 parts In-Stock

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$1.639

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403

$1.639

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Andel Nordic

Denmark . 617 parts In-Stock

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$2.953

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$2.834

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$2.834

617

$2.953

-

$2.834

$2.834

AZTECH Wire

Italy . 181 parts In-Stock

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$16.790

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181

$16.790

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$22.498

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$20.248

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713

$22.498

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$20.248

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Ampacity Inc.

Singapore . 541 parts In-Stock

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$29.000

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541

$29.000

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Microchip USA

USA . 178 parts In-Stock

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$31.509

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MKK Technologies

India . 502 parts In-Stock

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$42.305

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$42.305

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DigiPath Technology Company

USA . 502 parts In-Stock

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$42.305

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Perfect Parts

USA . 4,483 parts In-Stock

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Corphita

USA . 2,309 parts In-Stock

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Parana Technologies

USA . 1,133 parts In-Stock

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$26.899

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$26.899

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Overview

Unlock the full potential of your designs with the 74LCX16240TTR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This advanced bus driver and transceiver ensures lightning-fast data transfer, boosting efficiency across diverse applications like telecommunications and industrial automation. With its robust performance and superior reliability, you can count on seamless operation even in challenging environments. Elevate your projects with unmatched value and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, ensuring reliability in various applications.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this product allows for faster signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature enables easier integration onto PCBs, saving space and improving manufacturing efficiency.

No. of Functions: 4

Having four functions means versatility and the ability to handle multiple tasks within the same package.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout options on circuit boards, facilitating compact design.

No. of Bits: 4

Support for 4 bits allows for effective data handling in digital circuits.

Nominal Supply Voltage / Vsup (V): 2.7

Lower supply voltage is energy-efficient, making this product ideal for battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance minimizes power consumption and heat generation, enhancing overall performance.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in modern digital circuits, ensuring compatibility with a wide range of systems.

No. of Terminals: 48

Having multiple terminals accommodates extensive connectivity options, enabling more complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style enhances space efficiency, ideal for tight layouts in modern electronics.

Maximum I (ol): 24 Amp

High output current capability supports demanding applications with substantial load requirements.

Propagation Delay (tpd): 5.3 ns

A slightly higher propagation delay still allows for reliable high-speed signaling, suitable for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures functionality in harsh environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state outputs provide flexible connections in bus systems, enhancing versatility in communication setups.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures the product can operate effectively in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

A gold finish enhances conductivity and provides resistance to corrosion, promoting longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning offers improved mounting options and easier routing on circuit boards.

No. of Ports: 2

With two ports, the device supports dual-channel communication, facilitating better data handling applications.

Maximum Seated Height: 1.2 mm

A low profile design helps maintain a compact form factor in electronics, promoting space efficiency.

Width: 6.1 mm

The moderate width allows for a good fit in various PCB designs while ensuring connectivity.

Output Polarity: INVERTED

An inverted output polarity can be advantageous in certain logical configurations, enhancing the flexibility of circuit design.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enhances energy efficiency and supports operation in lower-power applications.

Length: 12.5 mm

Compact length contributes to space-saving designs suited for modern electronic devices.

Temperature Grade: MILITARY

MILITARY grade ensures high reliability and performance under challenging conditions, making it suitable for critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate excellent soldering and mechanical attachment, enhancing connection stability.

Packing Method: TR

Tape and reel packaging allows for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A narrow terminal pitch enables dense packing of components on PCBs, optimizing the circuit layout.

Control Type: ENABLE LOW

Low enable control simplifies interfacing and reduces the need for additional components in circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage provides a safe operational range, ensuring compatibility with a variety of systems.

Technical Specifications

Bus Driver & Transceivers 74LCX16240TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LCX16240TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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