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74ACT1284MTR

STMicroelectronics

74ACT1284MTR by STMicroelectronics

74ACT1284MTR by STMicroelectronics is a CMOS line transceiver with a max supply voltage of 5.5V and operates within -40 °C to 85 °C. It features 4 driver bits, 7 receiver bits, and boasts a max transmit/receive delay of just 8.5 ns. Ideal for industrial applications requiring fast data transfer per IEEE 1284 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,804 parts In-Stock

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Digiode

USA . 3,081 parts In-Stock

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Anansix

USA . 252 parts In-Stock

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252

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IDEA Electronic Components Group

UK . 1,326 parts In-Stock

1+ parts

$8.118

100+ parts

-

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$7.306

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1,326

$8.118

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$7.306

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Microchip USA

USA . 325 parts In-Stock

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$8.323

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325

$8.323

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MKK Technologies

India . 219 parts In-Stock

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$15.266

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219

$15.266

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DigiPath Technology Company

USA . 219 parts In-Stock

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$15.266

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219

$15.266

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Component Stockers USA

USA . 202 parts In-Stock

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$99.990

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202

$99.990

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Corphita

USA . 2,848 parts In-Stock

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Parana Technologies

USA . 2,353 parts In-Stock

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$9.706

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Native Components

USA . 612 parts In-Stock

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Northwest PG Solutions

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Overview

Elevate your designs with the 74ACT1284MTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance line driver/receiver excels in reliability and speed, making it ideal for industrial applications. With robust temperature ranges and exceptional signal integrity, it ensures seamless communication in demanding environments. Experience the advantage of superior quality and performance—choose STMicroelectronics for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures overall protection and reliability of the product in various environments.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing and improved circuit board space utilization.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for various applications.

No. of Functions: 4

Increased functionality in a single package minimizes the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape allows for simpler PCB layout and optimal utilization of space.

Maximum Transmit Delay: 8.5 ns

Low transmit delay ensures faster data transfer speeds, enhancing overall system performance.

No. of Terminals: 20

Having multiple terminals allows for greater connectivity options, making integration easier.

Package Style (Meter): SMALL OUTLINE

The small outline design is ideal for space-sensitive applications without compromising performance.

Minimum Supply Voltage: 4.5 V

The ability to operate at lower voltages can lead to lower power consumption, ideal for energy-efficient designs.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable operation in harsh industrial conditions.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, this product can function effectively in very low temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish enhances longevity and reduces the risk of oxidation for better connectivity.

Terminal Position: DUAL

Dual terminal positioning allows for greater flexibility in PCB layout and design.

Maximum Seated Height: 2.65 mm

A low seated height is ideal for compact designs, helping to maintain a slim profile in applications.

Width: 7.5 mm

Compact width enables more efficient use of board space while providing robust functionality.

Receiver No. of Bits: 7

Supporting 7-bit data transmission, this product meets the needs of complex systems.

Length: 12.8 mm

A manageable length supports easy integration into various circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability under demanding conditions.

Maximum Receive Delay: 8.5 ns

Quick receive delay enhances responsiveness in high-speed communications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Terminal Form: GULL WING

Gull wing terminals simplify PCB soldering processes, reducing assembly time and costs.

Interface Standard: IEEE 1284

Compliance with the widely-used IEEE 1284 standard facilitates easy integration with existing systems.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger inputs provide better noise immunity, ensuring reliable signal integrity in noisy environments.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V is standard for many devices, offering compatibility with diverse systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports efficient layout designs while allowing for adequate spacing between leads.

Driver No. of Bits: 4

A 4-bit driver capability meets the requirements for a broad range of applications.

Interface IC Type: LINE TRANSCEIVER

Designed as a line transceiver, this product is optimized for high-speed data communication in various applications.

Technical Specifications

Line Drivers & Receivers 74ACT1284MTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

4

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1284

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Receive Delay:

8.5 ns

Receiver No. of Bits:

7

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

8.5 ns

Width:

7.5 mm

Trade Compliance

74ACT1284MTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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