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SI8232AB-B-IS1R

Silicon Labs

SI8232AB-B-IS1R by Silicon Labs

SI8232AB-B-IS1R by Silicon Labs is a peripheral driver with a rectangular package shape and 16 terminals. It operates at temperatures ranging from -40 to 125 °C and is suitable for automotive applications. Its power supplies range from 3V to 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,906 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 550 parts In-Stock

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$0.500

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AZTECH Wire

Italy . 673 parts In-Stock

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$12.230

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Semicontronic

India . 517 parts In-Stock

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$38.500

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$37.538

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517

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Continental Prestige Electronics

USA . 4,393 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Experience unparalleled quality and performance with the SI8232AB-B-IS1R by Silicon Labs. As a leading manufacturer in the industry, Silicon Labs delivers exceptional peripheral drivers that exceed expectations. This product offers a range of applications, making it perfect for various projects. But what sets it apart is the immense value it brings to customers. From its durable plastic/epoxy package body material to its small outline package style, this product ensures reliability and longevity. With its dual terminal position and 1.27 mm terminal pitch, it provides easy installation and convenience. Whether you're working in automotive or any other field, the SI8232AB-B-IS1R is the choice that guarantees superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances durability and makes this peripheral driver suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, offering convenience and flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard device mounting, simplifying the manufacturing process and facilitating efficient assembly.

Power Supplies (V): 3/5

With support for power supplies of 3V and 5V, this peripheral driver offers versatility and compatibility with various voltage requirements, increasing its range of applications.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, enabling connections to multiple devices, improving overall functionality and usefulness.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving installation, making this peripheral driver suitable for compact electronic devices or designs with limited space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enhances the reliability and stability of this peripheral driver, making it well-suited for use in environments with elevated temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in device connections, allowing for different orientations and configurations, further enhancing the versatility of this peripheral driver.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures that this peripheral driver can withstand the demanding temperature conditions typically encountered in automotive applications, making it a reliable choice for such use cases.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto circuit boards, ensuring reliable electrical connections and enabling efficient manufacturing processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and compact arrangement of terminals, enabling higher density circuit designs and contributing to overall space-saving characteristics of this peripheral driver.

Technical Specifications

Peripheral Drivers SI8232AB-B-IS1R attributes and parameters. Explore more Peripheral Drivers devices from Silicon Labs

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SI8232AB-B-IS1R Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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