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EFM8BB31F32G-C-QFN32R

Silicon Labs

EFM8BB31F32G-C-QFN32R by Silicon Labs

Silicon Labs EFM8BB31F32G-C-QFN32R is an 8-bit microcontroller with 50 MHz clock frequency, 29 I/O lines, and ADC/DMA channels. It operates b/w 2.2-3.6V, suitable for applications requiring high-speed processing in compact designs like IoT devices and consumer electronics. Package style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE.

Median Price

$0.622

Lifecycle Status

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5

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1k+

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Arrow

USA . 10,000 parts In-Stock

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$0.994

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$0.251

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Verical

USA . 10,000 parts In-Stock

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Digiode

USA . 423 parts In-Stock

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$0.944

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Vyrian

USA . 2,470 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Ampacity Inc.

Singapore . 9,919 parts In-Stock

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$0.213

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Corphita

USA . 316 parts In-Stock

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Microchip USA

USA . 4,901 parts In-Stock

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AZTECH Wire

Italy . 699 parts In-Stock

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Corohmni

South Africa . 666 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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Overview

Unlock endless possibilities with the Silicon Labs EFM8BB31F32G-C-QFN32R microcontroller. Designed with precision and innovation, this powerful device offers reliable performance and unmatched efficiency for a wide range of applications. From IoT devices to industrial automation, this microcontroller delivers exceptional value, flexibility, and ease of use. Trust Silicon Labs to provide top-notch quality and cutting-edge technology to elevate your projects to the next level. Experience the difference with the EFM8BB31F32G-C-QFN32R and unleash your creativity today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for tight PCB layouts.

Bit Size: 8

8-bit processing capability offers a good balance between performance and cost for many applications.

No. of Terminals: 32

A sufficient number of terminals for connecting to various components and interfaces in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide flexibility in thermal management and physical dimensions for design requirements.

Minimum Supply Voltage: 2.2 V

Can operate at low supply voltages, saving power and enabling use in battery-powered applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and ensures reliable connections during assembly.

ADC Channels: YES

Built-in analog-to-digital converter channels enable interfacing with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfers, reducing CPU load.

Terminal Position: QUAD

Quad terminal position provides good stability and ease of soldering during assembly.

Width: 4 mm

Compact width allows for dense packing on PCBs and efficient use of space.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speeds for real-time applications and data handling.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for sufficient time at peak reflow temperature for reliable soldering and component attachment.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for lead-free soldering processes.

Length: 4 mm

Compact length complements the square package shape for a space-efficient design.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral ICs offer a complete solution for control and interfacing functions in a single package.

Terminal Form: NO LEAD

No-lead terminal form provides better thermal performance and reliability in assembly processes.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent operation and performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of output signals for motor control and other applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting of components on PCBs, optimizing space usage.

Moisture Sensitivity Level (MSL): 2

MSL level 2 ensures proper handling and storage requirements to prevent moisture-related issues during assembly.

Speed: 50 rpm

Operates at a speed of 50 rotations per minute, suitable for various motor control applications.

No. of I/O Lines: 29

A sufficient number of input/output lines for connecting to external devices and peripherals in a system.

Technical Specifications

Microcontrollers EFM8BB31F32G-C-QFN32R attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

50 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

29

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Trade Compliance

EFM8BB31F32G-C-QFN32R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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