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EFM32HG310F64G-B-QFN32

Silicon Labs

EFM32HG310F64G-B-QFN32 by Silicon Labs

EFM32HG310F64G-B-QFN32 by Silicon Labs is a 32-bit microcontroller with 3.8V max supply voltage, -40 to 85°C operating temp range, and 25MHz clock frequency. Ideal for industrial applications requiring DAC/ADC channels, DMA support, and various peripherals like PWM, RTC, and USB connectivity.

Median Price

$2.320

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Arrow

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Farnell

UK . 419 parts In-Stock

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$2.160

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$1.590

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$1.440

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Newark

USA . 419 parts In-Stock

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$2.320

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$1.930

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$1.760

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419

$2.320

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$1.760

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Chip1Stop

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Element14

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$3.570

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$2.970

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$2.880

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Verical

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Digiode

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Vyrian

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Chip Stock

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Nova Conductors

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Corphita

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Advanced Electronics

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$47.639

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$43.351

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$39.064

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Argo Parts USA

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Overview

Enhance your electronic designs with the EFM32HG310F64G-B-QFN32 microcontroller by Silicon Labs. With a wide range of peripherals including PWM, RTC, and USB connectivity, this high-quality chip offers endless possibilities for industrial applications. Silicon Labs' reputation for excellence ensures that you are getting a reliable and efficient product that will exceed your expectations. Upgrade to the EFM32HG310F64G-B-QFN32 today and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy integration onto printed circuit boards, making assembly more efficient and compact.

Maximum Supply Voltage: 3.8 V

With a maximum supply voltage of 3.8 V, this microcontroller can handle a wide range of power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for easier placement and routing on the PCB, optimizing space utilization.

Bit Size: 32

The 32-bit architecture of this microcontroller enables high-performance computing and processing capabilities, suitable for a variety of applications.

DAC Channels: YES

The presence of DAC channels allows for accurate analog voltage output, enhancing the microcontroller's compatibility with sensor interfacing and control applications.

No. of Terminals: 32

With 32 terminals available, this microcontroller offers ample connectivity options for external components, peripherals, and communication interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient thermal management and compact form factor for space-constrained designs.

Minimum Supply Voltage: 1.98 V

The low minimum supply voltage of 1.98 V allows for operation in scenarios where power constraints or battery-powered applications are a consideration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures reliable performance even in extreme cold or hot conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, enhancing the durability and reliability of the microcontroller in harsh environments.

ADC Channels: YES

The availability of ADC channels allows for precise analog-to-digital conversion, making the microcontroller suitable for interfacing with analog sensors and signals.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer between peripherals and memory without CPU intervention, improving system performance and responsiveness.

Terminal Position: QUAD

The quad terminal position offers standardized and organized connectivity layout, simplifying PCB design and assembly processes.

ROM Words: 65536

With 65536 ROM words, this microcontroller provides ample memory for storing program instructions, data, and firmware, supporting complex applications and algorithms.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm minimizes the overall profile of the microcontroller package, enabling integration into slim and compact electronic devices.

Width: 6 mm

The compact width of 6 mm contributes to the space-saving design of the microcontroller package, ideal for applications with size restrictions.

Peripherals: BOD, COMPARATOR, DMA(6), POR, PWM, RTC, TEMPERATURE SENSOR, TIMER(3), WDT

The rich set of peripherals including Brown-Out Detector (BOD), DMA controllers, PWM modules, Real-Time Clock (RTC), Temperature Sensor, and Watchdog Timer (WDT) enhances the microcontroller's functionality for diverse application requirements.

Maximum Clock Frequency: 25 MHz

The maximum clock frequency of 25 MHz provides high-speed processing capabilities, suitable for applications that demand rapid data processing and real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures reliable and consistent soldering during PCB assembly, facilitating manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C signifies the microcontroller's thermal resilience during soldering processes, maintaining solder joint integrity.

Length: 6 mm

The length of 6 mm contributes to the overall compact form factor of the microcontroller package, enabling space-efficient integration in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates the microcontroller's suitability for operation in rugged industrial environments with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, this product offers enhanced performance and power efficiency, making it a preferred choice for embedded systems and IoT applications.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller provides sufficient memory for temporary data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for conventional through-hole soldering, enabling higher connection density and simplified PCB layout.

Analog To Digital Convertors: 3-Ch 12-Bit

The presence of three 12-bit ADCs allows the microcontroller to capture and convert multiple analog signals with high resolution, catering to analog sensor interfacing and data acquisition needs.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures compatibility with common power sources and simplifies power management considerations during system design.

PWM Channels: YES

Having PWM channels enables the microcontroller to generate precise pulse-width modulated signals, crucial for controlling motor speeds, LED brightness, and other analog-driven functions.

Connectivity: I2C, I2S, IRDA, SPI, UART, USART(2), USB

Supporting various communication interfaces such as I2C, I2S, IRDA, SPI, UART, USART, and USB enhances the microcontroller's connectivity options for networking, data exchange, and external device interfacing.

ROM Programmability: FLASH

The flash ROM programmability allows for in-system programming and reprogramming of firmware, providing flexibility for updating software and firmware in deployed systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm facilitates high-density packaging and routing of signals on the PCB, enabling compact and space-efficient PCB designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microcontroller's tolerance to moderate exposure to moisture during storage and handling, ensuring reliability and longevity.

Speed: 25 rpm

The speed of 25 rpm indicates the maximum rotational speed of the microcontroller (metaphorically), denoting its processing capability and efficiency in executing tasks and instructions.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows the microcontroller to fetch and execute instructions efficiently, contributing to its overall processing speed and performance.

No. of I/O Lines: 22

With 22 I/O lines, the microcontroller facilitates versatile connectivity with external components and peripherals, enabling robust control and data exchange capabilities.

Technical Specifications

Microcontrollers EFM32HG310F64G-B-QFN32 attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.98 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, IRDA, SPI, UART, USART(2), USB

Peripherals:

BOD, COMPARATOR, DMA(6), POR, PWM, RTC, TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 12-Bit

Trade Compliance

EFM32HG310F64G-B-QFN32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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