Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
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Chip Carrier IC & Component Sockets ICA-308-ZAGT attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
Contact Style:
Installation Type:
Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
Mounting Style:
PCB Contact Layout:
IC Socket Type:
Housing Material:
Length:
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Depth:
JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
Special Features:
ICA-308-ZAGT Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Zowie Technology
Bytesonic Electronics
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Zetex Plc
Hitano Enterprise
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
Continental Device India
Temic Semiconductors
ICF-308-T-O
Samtec
Samtec's ICF-308-T-O is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and Liquid Crystal Polymer housing. It is used for DIP8 devices in applications requiring -55 to 125°C operating temperature range and surface mount termination.
1-2199298-1
TE Connectivity
TE Connectivity's 1-2199298-1 is a DIP6 IC socket with 6 contacts, bellowed type contact style, and solder termination. It has a PCB contact row spacing of 7.62mm and is used in applications requiring a mating contact pitch of 0.1 inch and dielectric voltage withstand of 1000VAC.
27E894
TE Connectivity 27E894 is a GLASS FILLED POLYESTER IC SOCKET with SCREW termination, suitable for RELAY devices. Featuring 14 RND PIN-SKT contacts with Tin finish (Sn), it offers reliable connectivity in chip carrier applications.
2833521
Phoenix Contact
RELAY SOCKET;
4-1571552-8
TE Connectivity's 4-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and PCT-plastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55°C to 105°C.
20-351000-11-RC
Aries Electronics
20-351000-11-RC by Aries Electronics is a 20-contact IC socket with brass contacts. It features gold over nickel contact finish for mating and termination. This chip carrier socket is designed for SSOP20-DIP20 devices, ensuring reliable connections in electronic applications.
4-1571551-4
TE Connectivity 4-1571551-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for applications requiring a mating contact pitch of 0.1 inch, such as chip carrier ICs.
0804MC
Texas Instruments
The Texas Instruments 0804MC is a transistor socket with 8 contacts. It features gold mating finish over nickel and tin termination finish over nickel. This chip carrier IC socket, made of polyester, is commonly used on TO-3 devices for secure connections in electronic applications.
ICO-308-NGG
The Samtec ICO-308-NGG is a Chip Carrier IC Socket with 8 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It uses beryllium copper for contacts, gold finish over nickel for mating, and operates b/w -65°C to 125°C. Ideal for DIP8 devices, it has a current rating of 1A and dielectric voltage withstand of 1000VAC.
1-390262-2
TE Connectivity's 1-390262-2 is a chip carrier IC socket with 28 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is used for DIP28 devices. With a temperature range of -40 to 105°C, it offers reliable performance in various applications.
XR2A-2402
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A; JESD-609 Code: e4;
5665
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC84; Additional Features: PLCC SOCKET, 94V-0; No. of Contacts: 84; Manufacturer Series: 5665;
2-1571550-2
TE Connectivity 2-1571550-2 is a DIP8 IC SOCKET with 8 contacts. It features PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a current rating of 3A. The socket has a housing made of PCT plastic polyester and operates within a temperature range of -55 to 105°C.
150-10-324-00-018101
Preci-dip Sa
150-10-324-00-018101 by Preci-dip Sa is a DIP24 IC socket with 24 brass contacts and gold finish. Its housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications, this socket offers reliable connectivity and durability in electronic devices.
116-93-314-41-008000
Mill-max Mfg
116-93-314-41-008000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP14 devices with 14 contacts. It features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for applications requiring reliable connections in electronic circuits.
410-93-220-10-001000
Mill-max Mfg 410-93-220-10-001000 is a Chip Carrier IC Socket with 20 contacts, staggered pattern, and 2.54mm pitch. It uses beryllium copper contacts for DIP20 devices, rated at 3A current. Ideal for PCBs with straight mounting style and operating temperatures from -55 to 125°C.
390261-4
TE Connectivity's 390261-4 is a Chip Carrier IC Socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP16 devices, it has a rectangular contact pattern and glass-filled PBT housing material.
ICF-640-S-O
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
XR2A-2825
IC SOCKET; Manufacturer Series: XR2;
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