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HLT-1917-T-H

Samtec

HLT-1917-T-H by Samtec

IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Chip Carrier IC & Component Sockets HLT-1917-T-H attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec

Connectivity

Number of Positions or Pins:

323

Contact Finish - Mating:

Tin over Nickel (50)

Contact Finish - Termination:

Tin with Nickel Barrier

Contact Material:

Brass

Physical Characteristics

IC Socket Type:

Housing Material:

JESD-609 Code:

e3

Compatibility

Compatible Device Type:

Trade Compliance

HLT-1917-T-H Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

Samtec

Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.

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