Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ISL6123IRZA-T by Renesas Electronics is a Power Management IC with a square package and a nominal voltage of 3.3V. It is commonly used as a power supply support circuit in industrial applications.
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The use of plastic/epoxy as the package body material ensures that the Power Management IC is lightweight and cost-effective, making it an efficient choice for power management applications.
With surface mount capability, this Power Management IC can be easily mounted on circuit boards, saving valuable space and enabling high-density design.
Featuring a single function, this Power Management IC is designed to efficiently perform one specific task in power management systems, ensuring simplicity and ease of use.
The square package shape of this IC allows for efficient utilization of board space, making it suitable for compact electronic devices.
Operating at a nominal supply voltage of 3.3 V, this Power Management IC provides a stable power supply, offering compatibility with various electronic components and systems.
With 24 terminals, this IC allows for a sufficient number of connections, facilitating versatile connectivity options in power management circuits.
The package style of this IC, consisting of chip carrier, heat sink/slug, and a very thin profile, enables efficient heat dissipation and compact integration, ideal for power management in space-constrained applications.
Designed to operate at a maximum temperature of 85°C, this Power Management IC ensures reliable performance even in demanding environments, providing stability and longevity.
With a minimum operating temperature of -40°C, the Power Management IC remains functional in extremely cold conditions, making it suitable for various industries and locations.
The matte tin terminal finish offers excellent corrosion resistance and solderability, ensuring reliable connections and efficient power management in diverse environments.
Featuring a quad terminal position, this IC allows for easy and reliable connection to external devices, enhancing the flexibility and usability of power management systems.
With a maximum seated height of 1 mm, this Power Management IC provides a low-profile solution, allowing for compact and space-saving designs in electronic devices.
Measuring 4 mm in width, this IC offers a compact form factor, contributing to space optimization in power management applications.
This Power Management IC acts as a power supply support circuit, providing stability, protection, and regulation for a reliable power management solution in various electronic devices.
Operating with a minimum supply voltage of 1.5 V, this IC can effectively manage lower voltage input, making it suitable for a wide range of power management applications.
With a maximum time of 30 seconds at peak reflow temperature, this IC ensures safe and efficient soldering during assembly, promoting reliable connections and robust power management.
Designed to withstand a peak reflow temperature of 260°C, this Power Management IC can endure high-temperature soldering processes, guaranteeing reliable performance in manufacturing and assembly.
Measuring only 4 mm in length, this Power Management IC offers a compact size, allowing for space-efficient integration in power management circuits.
Designed for industrial applications, this Power Management IC is built to meet stringent temperature and performance requirements, ensuring reliability and stability in challenging environments.
With four channels, this IC enables the management of multiple power sources or loads simultaneously, providing increased versatility and efficiency in power management systems.
Featuring a no-lead terminal form, this IC offers a lead-free design, complying with environmental regulations and promoting sustainable and eco-friendly power management solutions.
This IC has a terminal pitch of 0.5 mm, allowing for close spacing between terminals, enabling high-density integration and improved electrical performance in power management applications.
With a moisture sensitivity level of 3, this Power Management IC exhibits moderate moisture resistance, making it suitable for a range of humid environments while maintaining its performance and reliability.
Operating at a maximum supply voltage of 5 V, this IC can handle higher voltage inputs, providing versatility and compatibility with various power management systems.
Offering adjustable threshold capabilities, this Power Management IC allows for customization and fine-tuning of voltage levels, meeting specific power management requirements with precision.
Power Management ICs ISL6123IRZA-T attributes and parameters. Explore more Power Management ICs devices from Renesas Electronics
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ISL6123IRZA-T Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99WT1G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Formosa Microsemi
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Infinex
Rfe International
Harris Semiconductor
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Multicomp Pro
General Instrument
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
LTC4151IMS#PBF
Analog Devices
LTC4151IMS#PBF by Analog Devices is a Power Management IC with 10 terminals, operating b/w -40 to 85°C. It supports supply voltages from 7V to 80V and has a small outline package suitable for industrial applications. The CMOS technology and dual terminal position make it ideal for power supply support circuits in various electronic devices.
LTC4417IUF#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
LTC6813ILWE-1#3ZZTRPBF
LTC6813ILWE-1#3ZZTRPBF by Analog Devices is a Power Management IC with 64 terminals, suitable for industrial applications. It operates b/w -40 to 85°C, with a supply voltage range of 16-90V. This CMOS technology IC features adjustable threshold and AEC-Q100 screening level for automotive use.
TPS25940ARVCR
TPS25940ARVCR by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It supports a max output current of 5.2A and has an adjustable threshold with a supply voltage range of 2.7-18V. Ideal for industrial applications requiring precise power supply support in compact spaces due to its very thin profile chip carrier package style.
LTC4357HMS8#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
PINA234AIYBJR
PINA234AIYBJR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for automotive applications. It features a grid array package style with very thin profile and fine pitch terminals. With an adjustable threshold and operating temperature range from -40 to 125 °C, it offers versatile power supply support in compact designs.
TPS2421-2DDAR
TPS2421-2DDAR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 5.5A max output current, and 20V max supply voltage. It is designed for automotive applications and features a small outline package with gull wing terminals for surface mounting.
LTC4364HS-2#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FDC6329L
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 6; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
LT8490EUKJ#PBF
BATTERY CHARGE CONTROLLER; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
TUSB4041IPAPQ1
TUSB4041IPAPQ1 by Texas Instruments is a Power Management IC with a supply voltage range of 0.99V to 1.26V. It has a package style of flatpack, heat sink/slug, thin profile, and fine pitch. This IC is commonly used as a power supply support circuit in industrial applications.
TPS3801K33DCKRG4
TPS3801K33DCKRG4 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V, suitable for industrial applications. It features a small outline package style, dual terminal position, and CMOS technology. With a max operating temperature of 85°C and low supply current of 0.025mA, it offers reliable power supply support in compact designs.
LM5069MM-1/NOPB
National Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
INA226AIDGST
INA226AIDGST by Texas Instruments is a Power Management IC with 10 terminals, operating at -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and is ideal for automotive applications due to its small outline package style and low supply current of 0.42 mA.
LTC4364HS-2#PBF by Analog Devices is a Power Management IC with 16 terminals, operating b/w -40 to 125 °C. It supports supply voltages from 4V to 80V and has an adjustable threshold of +2.2V, making it ideal for automotive applications requiring power supply support circuits.
LTC2955ITS8-1#TRMPBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FPF2163
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES;
FPF2163 by Onsemi is a surface mount power management IC with 1 function. It has a nominal voltage of 3.3V and can operate in temperatures ranging from -40 to 85°C. This IC, with its small outline package style, is commonly used as a power supply support circuit in industrial applications.
MAX20303BEWN+T
Maxim Integrated
POWER SUPPLY SUPPORT CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER NICKEL; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
MCP73833-FCI/UN
Microchip Technology
MCP73833-FCI/UN by Microchip is a Power Management IC with Vsup range of 3.8-5.5V, suitable for industrial applications. It features a small outline package with dual terminals and matte tin finish, operating b/w -40 to 85°C. With adjustable threshold and peak reflow temp of 260°C, it supports power supply circuits in compact designs.
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ISL6292-2CR3Z-T
Integrated Device Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 10; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES;
Renesas Electronics
The Renesas Electronics ISL6292-2CR3Z-T is a Power Management IC with 10 terminals, operating voltage range of 4.3V to 6.5V, and small outline package style. It has a max temperature of 70°C and is suitable for power supply support circuits in various applications.
Intersil
ISL6292-2CR4Z
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
ISL61852ACRZ
POWER SUPPLY SUPPORT CIRCUIT; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES;
ISL6123IRZA-T
ISL6123IRZA
ISL6256AHAZ-T
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ISL6140IBZ-T
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ISL6140IBZ-T by Renesas Electronics is a Power Management IC with a supply voltage range of 36V to 72V. It features a small outline package, matte tin terminal finish, and industrial temperature grade. Ideal for power supply support circuits in applications requiring a nominal voltage of 48V and operating temperatures from -40°C to 85°C.
ISL6292-2CR4Z-T
ISL6292-2CR4Z-T by Renesas Electronics is a Power Management IC with 16 terminals and a supply voltage range of 4.3V to 6.5V. It operates b/w -20°C to 70°C, suitable for power supply support circuits in various applications due to its compact square package design and surface-mount capability.
ISL6123IR
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