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TEA1068

Philips Semiconductors

TEA1068 by Philips Semiconductors

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

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Vyrian

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Speed Components Ltd

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Component Sense

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Huijzer Components

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GES GmbH

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LittleDiode

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One Stop Electronics

USA . 1,248 parts In-Stock

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Corphita

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Technical Specifications

Telephone Line ICs TEA1068 attributes and parameters. Explore more Telephone Line ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.95/7.5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.3 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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