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HEF4066BPN

Philips Semiconductors

HEF4066BPN by Philips Semiconductors

SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

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USA . 407 parts In-Stock

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Northwest PG Solutions

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Technical Specifications

Multiplexers & Switches HEF4066BPN attributes and parameters. Explore more Multiplexers & Switches devices from Philips Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

2500 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HEF4066BPN Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-241-8637, 5962012418637

NIIN

012418637

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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