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HEF40097BTD-T

Philips Semiconductors

HEF40097BTD-T by Philips Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,672 parts In-Stock

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Anansix

USA . 2,646 parts In-Stock

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Digiode

USA . 903 parts In-Stock

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903

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Native Components

USA . 434 parts In-Stock

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$0.987

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434

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Northwest PG Solutions

USA . 834 parts In-Stock

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$1.085

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834

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One Stop Electronics

USA . 1,091 parts In-Stock

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$4.000

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Andel Nordic

Denmark . 5,817 parts In-Stock

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$30.510

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$21.359

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$21.359

5,817

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$21.359

$21.359

Corphita

USA . 4,215 parts In-Stock

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UNI Independent Distributors

Spain . 4,057 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers HEF40097BTD-T attributes and parameters. Explore more Bus Driver & Transceivers devices from Philips Semiconductors

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

2.3 Amp

No. of Bits:

6

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.12 mA

Propagation Delay At Nominal Supply:

140 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HEF40097BTD-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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