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BF556C

Philips Semiconductors

BF556C by Philips Semiconductors

N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): .25 W; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN;

Median Price

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Digiode

USA . 2,938 parts In-Stock

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Anansix

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Vyrian

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499

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ECAB

Sweden . 330 parts In-Stock

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One Stop Electronics

USA . 155 parts In-Stock

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Kepictronics

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UNI Independent Distributors

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Corphita

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Alle Elektronik GmbH

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Northwest PG Solutions

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Native Components

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Perfect Parts

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Technical Specifications

Other Function Transistors BF556C attributes and parameters. Explore more Other Function Transistors devices from Philips Semiconductors

Specs

Field Effect Transistor Technology:

JUNCTION

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

BF556C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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