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82S123/BFA

Philips Semiconductors

82S123/BFA by Philips Semiconductors

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;

Median Price

$12.556

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 18 parts In-Stock

1+ parts

$12.556

100+ parts

$13.184

1k+ parts

$12.431

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18

$12.556

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$12.431

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Anansix

USA . 1,654 parts In-Stock

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Digiode

USA . 659 parts In-Stock

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659

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Vyrian

USA . 121 parts In-Stock

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121

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Resion

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 86 parts In-Stock

1+ parts

$1.005

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86

$1.005

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Northwest PG Solutions

USA . 1,181 parts In-Stock

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$1.105

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1,181

$1.105

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One Stop Electronics

USA . 1,050 parts In-Stock

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$6.000

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1,050

$6.000

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UNI Independent Distributors

Spain . 7,232 parts In-Stock

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Corphita

USA . 3,314 parts In-Stock

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Technical Specifications

OTP ROM 82S123/BFA attributes and parameters. Explore more OTP ROM devices from Philips Semiconductors

Specs

Maximum Access Time:

65 ns

JESD-30 Code:

R-XDFP-F16

JESD-609 Code:

e0

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

82S123/BFA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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