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74LVC1G3157GM

Philips Semiconductors

74LVC1G3157GM by Philips Semiconductors

SINGLE-ENDED MULTIPLEXER; Temperature Grade: AUTOMOTIVE; No. of Terminals: 6; Package Code: SON; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

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8

In-Stock Inventory

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Chip Stock

USA . 192,500 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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Cyclops Electronics Ltd

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Atlantic Semiconductor

USA . 4,900 parts In-Stock

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Digiode

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Vyrian

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Anansix

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Native Components

USA . 486 parts In-Stock

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Northwest PG Solutions

USA . 1,555 parts In-Stock

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AZTECH Wire

Italy . 13,121 parts In-Stock

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One Stop Electronics

USA . 652 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Assy Fe

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Corphita

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Supply Digital

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Technical Specifications

Multiplexers & Switches 74LVC1G3157GM attributes and parameters. Explore more Multiplexers & Switches devices from Philips Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e0

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

45 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

74LVC1G3157GM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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