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74AHCT157PW

Philips Semiconductors

74AHCT157PW by Philips Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,361 parts In-Stock

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Digiode

USA . 4,490 parts In-Stock

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Anansix

USA . 2,460 parts In-Stock

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Native Components

USA . 1,281 parts In-Stock

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$0.441

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$0.423

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Northwest PG Solutions

USA . 4,038 parts In-Stock

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$0.485

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$0.428

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$0.485

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AZTECH Wire

Italy . 8,228 parts In-Stock

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$3.920

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Ampacity Inc.

Singapore . 1,616 parts In-Stock

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$33.000

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One Stop Electronics

USA . 495 parts In-Stock

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$38.000

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UNI Independent Distributors

Spain . 6,182 parts In-Stock

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Kepictronics

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Corphita

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Supply Digital

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Technical Specifications

Multiplexer & Demultiplexer 74AHCT157PW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74AHCT157PW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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