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54LS175/BFA

Philips Semiconductors

54LS175/BFA by Philips Semiconductors

D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,192 parts In-Stock

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Anansix

USA . 2,089 parts In-Stock

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2,089

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Electronic Expediters

USA . 552 parts In-Stock

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552

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Vyrian

USA . 27 parts In-Stock

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27

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NAC Semi

USA . 23 parts In-Stock

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Native Components

USA . 350 parts In-Stock

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$1.170

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350

$1.170

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Northwest PG Solutions

USA . 2,306 parts In-Stock

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$1.287

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One Stop Electronics

USA . 1,538 parts In-Stock

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$190.100

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$190.100

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UNI Independent Distributors

Spain . 1,997 parts In-Stock

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Corphita

USA . 148 parts In-Stock

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Technical Specifications

Latches & Flip-Flops 54LS175/BFA attributes and parameters. Explore more Latches & Flip-Flops devices from Philips Semiconductors

Specs

JESD-30 Code:

R-XDFP-F16

JESD-609 Code:

e0

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

18 mA

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

54LS175/BFA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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