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SLG5001

Onsemi

SLG5001 by Onsemi

SLG5001 by Onsemi is an optoelectronic component with 22 LEDs emitting green-yellow/red light at peak wavelength of 660nm. It operates b/w -25 °C to 60°C, offering a min luminous intensity of 2.2cd. Ideal for applications requiring high-intensity illumination in various temperature conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,467 parts In-Stock

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2,467

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Digiode

USA . 1,790 parts In-Stock

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1,790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,922 parts In-Stock

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6,922

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TANS Electronics

Latvia . 6,876 parts In-Stock

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6,876

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SupplyDigital Components

Austria . 3,276 parts In-Stock

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3,276

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Problanco Electronics

Mexico . 2,046 parts In-Stock

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2,046

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Corphita

USA . 1,837 parts In-Stock

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1,837

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Corohmni

South Africa . 476 parts In-Stock

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476

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UHIMA Technologies

Türkiye . 55 parts In-Stock

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Overview

Unleash the power of light with the SLG5001 by Onsemi. Crafted with precision and expertise, this innovative optoelectronics device offers unmatched quality and reliability. Perfect for a wide range of applications, this product provides exceptional value to customers looking for superior performance and efficiency. Illuminate your projects with ease and experience the difference that Onsemi's SLG5001 can make in your work.

Feature Benefit Bullets

Peak Wavelength: 660 nm

This specific wavelength of light is ideal for applications requiring a red or green-yellow color output.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature, this product can withstand heat better than others, making it suitable for various environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows this product to function effectively even in cold conditions.

Minimum Luminous Intensity: 2.2 cd

The minimum luminous intensity of 2.2 cd ensures that the product provides a sufficiently bright light output.

Color At Wavelength: Green-Yellow/Red

The ability to emit both green-yellow and red colors at the specified wavelength adds versatility to the product's applications.

No. of LEDs in Array: 22

The array of 22 LEDs enhances the overall brightness and coverage of the light output, making this product suitable for larger illuminated areas.

Technical Specifications

Other Function Optoelectronics SLG5001 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Color At Wavelength:

Green-Yellow/Red

Minimum Luminous Intensity:

2.2 cd

No. of LEDs in Array:

22

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-25 Cel

Peak Wavelength (nm):

660

Sub-Category:

Other Optoelectronics

Trade Compliance

SLG5001 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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