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SCY99250CFCT195215T2G

Onsemi

SCY99250CFCT195215T2G by Onsemi

SCY99250CFCT195215T2G by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It has a min input voltage of 2.45V and max output current of 0.2A per output. This regulator, in a grid array package style, is suitable for applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,131 parts In-Stock

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Vyrian

USA . 553 parts In-Stock

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TANS Electronics

Latvia . 7,458 parts In-Stock

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Problanco Electronics

Mexico . 4,211 parts In-Stock

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Kulean Microsystems

USA . 3,475 parts In-Stock

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Corphita

USA . 1,882 parts In-Stock

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UHIMA Technologies

Türkiye . 651 parts In-Stock

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651

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Corohmni

South Africa . 283 parts In-Stock

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SupplyDigital Components

Austria . 102 parts In-Stock

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Overview

Enhance your electronic projects with the SCY99250CFCT195215T2G by Onsemi, a top-quality Fixed Regulator that delivers reliable performance and precision. Manufactured by Onsemi, a trusted name in the industry, this regulator offers multiple output LDO capabilities and is perfect for a wide range of applications. With its compact design and high efficiency, this product provides exceptional value and benefits to customers seeking superior power management solutions. Upgrade your projects today with the SCY99250CFCT195215T2G and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and heat-resistant, making the package robust for various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Operating Temperature (TJ-Max): 85 °C

Wide operating temperature range ensures reliable performance in different environments.

Minimum Output Voltage-2: 2.107 V

Accurate and stable output voltage ensures consistent power supply to connected components.

Nominal Output Voltage-2: 2.15 V

Precise output voltage regulation for optimal performance of the connected devices.

Package Shape: SQUARE

Square shape design provides efficient use of space on the circuit board.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable connections to the circuit.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature allows for use in cold environments without performance issues.

Packing Method: TR

TR packing method ensures convenient handling and storage of the product for manufacturers.

Minimum Output Voltage-1: 1.911 V

Provides a lower output voltage option for compatibility with a variety of components.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures stable and accurate power delivery to connected devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO SCY99250CFCT195215T2G attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.45 V

JESD-30 Code:

S-PBGA-B4

Length:

.64 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

4

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Current-2:

.2 A

Maximum Output Voltage-1:

1.989 V

Minimum Output Voltage-1:

1.911 V

Nominal Output Voltage-1:

1.95 V

Maximum Output Voltage-2:

2.193 V

Minimum Output Voltage-2:

2.107 V

Nominal Output Voltage-2:

2.15 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,14

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Maximum Seated Height:

.33 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Width:

.64 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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