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QEB363

Onsemi

QEB363 by Onsemi

QEB363 by Onsemi is a 2mm IR LED with peak wavelength of 940nm. It has max forward current of 0.05A and operates b/w -40 °C to 100°C. Ideal for surface mount applications requiring a round shape, it offers a viewing angle of 24° and max forward voltage of 1.6V.

Median Price

$0.151

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$0.094

100+ parts

$0.093

1k+ parts

-

10k+ parts

-

1,000

$0.094

$0.093

-

-

DigiKey

USA . 1,009 parts In-Stock

1+ parts

$0.470

100+ parts

$0.231

1k+ parts

$0.176

10k+ parts

$0.144

1,009

$0.470

$0.231

$0.176

$0.144

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Rochester

USA . 985 parts In-Stock

1+ parts

-

100+ parts

$0.151

1k+ parts

$0.125

10k+ parts

$0.112

985

-

$0.151

$0.125

$0.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 415 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

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415

$0.089

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Vyrian

USA . 1,710 parts In-Stock

1+ parts

$0.094

100+ parts

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1,710

$0.094

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Flip Electronics

USA . 17,000 parts In-Stock

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17,000

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ACDS - Activité Composants Distribution Service

France . 3,530 parts In-Stock

1+ parts

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3,530

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

1+ parts

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,329 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

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2,329

$0.085

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Corohmni

South Africa . 459 parts In-Stock

1+ parts

$0.094

100+ parts

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459

$0.094

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.094

100+ parts

$0.093

1k+ parts

$0.089

10k+ parts

-

1,000

$0.094

$0.093

$0.089

-

Metaverse IC Inc.

Canada . 36,530 parts In-Stock

1+ parts

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36,530

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Perfect Parts

USA . 29,071 parts In-Stock

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29,071

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QUARKTWIN TECHNOLOGY LTD

USA . 10,654 parts In-Stock

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10,654

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Problanco Electronics

Mexico . 7,702 parts In-Stock

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7,702

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Kepictronics

USA . 7,582 parts In-Stock

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7,582

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Kulean Microsystems

USA . 7,538 parts In-Stock

1+ parts

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7,538

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SupplyDigital Components

Austria . 7,178 parts In-Stock

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7,178

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TANS Electronics

Latvia . 5,959 parts In-Stock

1+ parts

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5,959

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Cyclops Electronics Ltd (Excess)

UK . 3,530 parts In-Stock

1+ parts

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3,530

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Glotronic Ltd.

UK . 2,824 parts In-Stock

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2,824

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Supply Digital

USA . 1,946 parts In-Stock

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1,946

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UHIMA Technologies

Türkiye . 774 parts In-Stock

1+ parts

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774

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Overview

Illuminate your world with the QEB363 Infrared LED by Onsemi. Boasting superior quality and precision engineering, this tiny but powerful component offers endless possibilities in applications such as remote controls, security systems, and proximity sensors. Experience the enhanced performance and reliability that Onsemi is renowned for, while enjoying the convenience and efficiency that this product brings to your projects. Upgrade your designs with the QEB363 Infrared LED today.

Feature Benefit Bullets

Configuration: SINGLE

The single configuration of this Infrared LED simplifies the design and installation process, making it a user-friendly choice.

Size: 2 mm

The compact size of 2mm makes this Infrared LED suitable for applications where space is limited.

Maximum Forward Current: 0.05 A

With a maximum forward current of 0.05 A, this Infrared LED offers efficient operation and helps in conserving energy.

Peak Wavelength (nm): 940

The peak wavelength of 940 nm makes this Infrared LED suitable for various sensing and communication applications.

Optoelectronic Type: INFRARED LED

Being an Infrared LED, this product offers superior performance in applications requiring infrared light emission.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100 °C ensures the reliability and durability of this Infrared LED in varying environmental conditions.

Shape: ROUND

The round shape facilitates easy mounting and alignment of the Infrared LED, making it a convenient choice for installation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows this Infrared LED to function effectively even in cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable electrical connection and ensures long-term performance of this Infrared LED.

Maximum Reverse Voltage: 5 V

With a maximum reverse voltage of 5 V, this Infrared LED offers protection against reverse current flow, enhancing its durability.

Semiconductor Material: GaAs

The use of GaAs as the semiconductor material in this Infrared LED ensures high efficiency and stability in light emission.

Viewing Angle: 24°

The wide viewing angle of 24° allows for better coverage and illumination in applications where a wide area needs to be covered.

Mounting Feature: SURFACE MOUNT

The surface mount feature of this Infrared LED makes it easy to install on circuit boards, saving time and effort during assembly.

Maximum Forward Voltage: 1.6 V

With a maximum forward voltage of 1.6 V, this Infrared LED operates efficiently and helps in reducing power consumption.

Technical Specifications

Infrared LEDs QEB363 attributes and parameters. Explore more Infrared LEDs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.6 V

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Peak Wavelength (nm):

940

Maximum Reverse Voltage:

5 V

Semiconductor Material:

GaAs

Shape:

ROUND

Size:

2 mm

Sub-Category:

Infrared LEDs

Terminal Finish:

Viewing Angle:

24 deg

Trade Compliance

QEB363 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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