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P3P2590AF-06OR

Onsemi

P3P2590AF-06OR by Onsemi

P3P2590AF-06OR clock generator by Onsemi operates at a max output frequency of 120 MHz with supply voltages of 2.5/3.3 V. It is a small outline, thin profile package suitable for commercial temperature grade applications requiring precise clock generation in CMOS technology. The device features dual terminals and gull wing form factor for easy surface mounting in various electronic systems.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,330 parts In-Stock

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Vyrian

USA . 888 parts In-Stock

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Kulean Microsystems

USA . 8,380 parts In-Stock

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SupplyDigital Components

Austria . 4,894 parts In-Stock

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Corphita

USA . 2,125 parts In-Stock

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TANS Electronics

Latvia . 1,546 parts In-Stock

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Vigor

Singapore . 950 parts In-Stock

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UHIMA Technologies

Türkiye . 432 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Problanco Electronics

Mexico . 156 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision timing with the P3P2590AF-06OR clock generator by Onsemi. Crafted with top-quality materials and cutting-edge technology, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this clock generator provides seamless synchronization in a compact, easy-to-install package. Experience the seamless operation, efficiency, and accuracy that only Onsemi can deliver. Elevate your projects with the exceptional value and benefits of the P3P2590AF-06OR clock generator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power source options, making it suitable for a variety of applications.

Maximum Output Clock Frequency: 120 MHz

The high maximum output clock frequency enables fast and efficient data processing, making it ideal for high-performance systems.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator efficient and reliable.

Technical Specifications

Clock Generators P3P2590AF-06OR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Terminals:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

120 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Nominal Primary Clock/Crystal Frequency:

120 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

P3P2590AF-06OR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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