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P3P25812AG-08SR

Onsemi

P3P25812AG-08SR by Onsemi

P3P25812AG-08SR clock generator by Onsemi operates at 64 MHz max output frequency, with a supply voltage range of 2.8V to 3.6V. It is a small outline package suitable for surface mount applications in commercial temperature grades. This CMOS technology device has 8 terminals and consumes up to 13mA of supply current at 3.3V nominal voltage, making it ideal for various peripheral IC clock generation needs.

Median Price

$1.548

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,549 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.260

10k+ parts

$1.120

26,549

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$1.520

$1.260

$1.120

Verical

USA . 26,549 parts In-Stock

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-

100+ parts

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$1.575

10k+ parts

$1.400

26,549

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-

$1.575

$1.400

Distributors (In-Stock)

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Digiode

USA . 138 parts In-Stock

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$1.188

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138

$1.188

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Vyrian

USA . 3,220 parts In-Stock

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3,220

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Distributors (Availability)

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Corphita

USA . 267 parts In-Stock

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$1.125

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267

$1.125

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Vigor

Singapore . 500 parts In-Stock

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$1.200

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500

$1.200

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Corohmni

South Africa . 259 parts In-Stock

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$1.250

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259

$1.250

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AZTECH Wire

Italy . 1,178 parts In-Stock

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$14.500

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$14.500

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$21.861

100+ parts

$19.894

1k+ parts

$17.926

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870

$21.861

$19.894

$17.926

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Continental Prestige Electronics

USA . 35,000 parts In-Stock

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$1.060

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Perfect Parts

USA . 22,378 parts In-Stock

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Kulean Microsystems

USA . 5,432 parts In-Stock

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Problanco Electronics

Mexico . 5,182 parts In-Stock

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SupplyDigital Components

Austria . 4,050 parts In-Stock

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TANS Electronics

Latvia . 1,035 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Microchip USA

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Overview

Elevate your electronic projects with the P3P25812AG-08SR clock generator by Onsemi. Crafted with precision and expertise, this small outline package offers a maximum output clock frequency of 64 MHz, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3 V and low power consumption of only 13 mA, this clock generator maximizes efficiency without compromising performance. Whether you're designing consumer electronics or industrial equipment, this product delivers reliable, high-quality results that exceed expectations. Upgrade your designs today with the P3P25812AG-08SR from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the clock generator.

Surface Mount: YES

Being surface mountable makes it easy to integrate this clock generator into electronic circuits, saving space and facilitating automated manufacturing processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with various systems.

Maximum Output Clock Frequency: 64 MHz

The high maximum output clock frequency of 64 MHz enables this clock generator to provide precise timing for fast and complex electronic systems.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures reliable performance in a variety of environmental conditions.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Nominal Primary Clock/Crystal Frequency: 32 MHz

With a nominal primary clock/crystal frequency of 32 MHz, this clock generator can accurately generate timing signals for digital circuits requiring this frequency.

Technical Specifications

Clock Generators P3P25812AG-08SR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

64 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

32 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Peripheral IC Type:

Trade Compliance

P3P25812AG-08SR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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