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NXV04V120DB1

Onsemi

NXV04V120DB1 by Onsemi

The Onsemi NXV04V120DB1 is a MOSFET Gate Driver with AEC-Q100 screening. It features a turn-on time of 0.102 us and turn-off time of 0.091 us, suitable for automotive applications. This full bridge based driver operates b/w -40 to 150 °C, making it ideal for high-temperature environments in vehicles.

Median Price

$25.038

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 147 parts In-Stock

1+ parts

$27.190

100+ parts

$17.550

1k+ parts

$17.430

10k+ parts

-

147

$27.190

$17.550

$17.430

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DigiKey

USA . 38 parts In-Stock

1+ parts

$28.150

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-

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38

$28.150

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-

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Rochester

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$17.390

1k+ parts

$15.560

10k+ parts

$14.650

37

-

$17.390

$15.560

$14.650

Verical

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$22.887

1k+ parts

-

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31

-

$22.887

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Distributors (In-Stock)

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Digiode

USA . 1,791 parts In-Stock

1+ parts

$22.486

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1,791

$22.486

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Vyrian

USA . 7,287 parts In-Stock

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7,287

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Flip Electronics

USA . 220 parts In-Stock

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220

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Distributors (Availability)

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Corphita

USA . 543 parts In-Stock

1+ parts

$21.303

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-

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543

$21.303

-

-

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$23.670

100+ parts

-

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249

$23.670

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-

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Microchip USA

USA . 3,346 parts In-Stock

1+ parts

$65.642

100+ parts

-

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3,346

$65.642

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Kulean Microsystems

USA . 6,567 parts In-Stock

1+ parts

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6,567

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SupplyDigital Components

Austria . 6,367 parts In-Stock

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6,367

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Problanco Electronics

Mexico . 3,759 parts In-Stock

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3,759

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TANS Electronics

Latvia . 1,935 parts In-Stock

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1,935

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UHIMA Technologies

Türkiye . 864 parts In-Stock

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864

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 44 parts In-Stock

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Overview

The NXV04V120DB1 by Onsemi is a top-of-the-line MOSFET Gate Driver that promises exceptional quality and reliability. With its AEC-Q100 screening level and automotive-grade temperature grade, this product is designed to meet the most stringent standards. Perfect for a wide range of applications, this driver offers unparalleled value with its quick turn-on/off times, dual terminal position, and compact design. Trust Onsemi to deliver cutting-edge technology and superior performance with the NXV04V120DB1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to harsh environmental conditions, making this product suitable for automotive applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product ideal for automotive use where robustness is crucial.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can handle demanding operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows this product to be used in a variety of environments, including cold climates.

Turn-on Time: 0.102 us

Fast turn-on time ensures quick response and efficient operation of the MOSFET gate driver, making it suitable for high-speed applications.

Technical Specifications

MOSFET Gate Drivers NXV04V120DB1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDIP-T19

Length:

44 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

5.2 mm

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.091 us

Turn-on Time:

.102 us

Width:

29 mm

Trade Compliance

NXV04V120DB1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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