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NUD4301MNT1G

Onsemi

NUD4301MNT1G by Onsemi

NUD4301MNT1G by Onsemi is a LED display driver with 8 terminals, 3.6V supply, and 6V max voltage. Its small outline package makes it suitable for graphics displays requiring precise control and low power consumption. With surface mount capability and nickel gold palladium finish, it offers efficient performance in compact applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,343 parts In-Stock

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Digiode

USA . 1,694 parts In-Stock

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1,694

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Distributors (Availability)

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AZTECH Wire

Italy . 36 parts In-Stock

1+ parts

$12.530

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36

$12.530

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TANS Electronics

Latvia . 6,632 parts In-Stock

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SupplyDigital Components

Austria . 5,418 parts In-Stock

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Problanco Electronics

Mexico . 5,163 parts In-Stock

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Kulean Microsystems

USA . 3,409 parts In-Stock

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UHIMA Technologies

Türkiye . 556 parts In-Stock

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556

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Corohmni

South Africa . 415 parts In-Stock

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415

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Microchip USA

USA . 397 parts In-Stock

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Corphita

USA . 311 parts In-Stock

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Overview

Experience the cutting-edge technology of Onsemi with the NUD4301MNT1G graphics display driver. Designed with precision and quality in mind, this product offers seamless integration for various applications. From LED displays to digital signage, this driver delivers superior performance and reliability. Enhance your visual experience with the NUD4301MNT1G and unlock a world of possibilities in the world of graphics. Elevate your projects with Onsemi's innovative solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 6 V

With a high maximum supply voltage, this product can support a wide range of applications and voltage requirements.

Package Shape: SQUARE

The square shape of the package allows for a compact and efficient design, perfect for space-constrained applications.

Power Supplies (V): 3.6

The low power supply voltage of 3.6V ensures energy efficiency and reduces power consumption.

No. of Terminals: 8

Having 8 terminals provides more connectivity options and flexibility in the circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a combination of small size, efficient heat dissipation, and a slim profile, making it suitable for compact and high-performance applications.

Terminal Finish: NICKEL GOLD PALLADIUM

This terminal finish enhances the product's durability and conductivity, ensuring a reliable connection over time.

Terminal Position: DUAL

Dual terminal position allows for redundancy and improved connectivity, enhancing the product's reliability.

Maximum Seated Height: 1 mm

With a low seated height, this product can fit into tight spaces and slim designs without compromising performance.

Width: 2 mm

The narrow width of 2mm enables the product to be used in compact and space-saving applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specifies the maximum time the product can withstand peak reflow temperature, ensuring reliable performance during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering and assembly of the product on the circuit board.

Length: 2 mm

The short length of 2mm contributes to the overall compact design of the product, ideal for space-constrained applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations for hazardous substance restrictions.

Nominal Supply Voltage: 3.6 V

With a nominal supply voltage of 3.6V, the product operates efficiently and reliably within the specified voltage range.

No. of Segments: 2

Having 2 segments allows for versatile display options and customization, making the product suitable for various display applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and precise connections, crucial for compact circuit designs.

Interface IC Type: LED DISPLAY DRIVER

This product is specifically designed as an LED display driver, ensuring compatibility and optimal performance for LED display applications.

Technical Specifications

Graphics Display Drivers NUD4301MNT1G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

6 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NUD4301MNT1G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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