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NTB90N02T4G

Onsemi

NTB90N02T4G by Onsemi

NTB90N02T4G by Onsemi is a N-CHANNEL FET with 24V DS Breakdown Voltage, 200A IDM, and 0.0058 ohm RDS. It's used for SWITCHING applications due to its 85W Pdiss, 733mJ EAS, and ENHANCEMENT MODE operation.

Median Price

$0.686

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,795 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

5,795

-

$0.674

$0.559

$0.498

Verical

USA . 5,600 parts In-Stock

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$0.699

10k+ parts

$0.623

5,600

-

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$0.699

$0.623

Distributors (In-Stock)

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Digiode

USA . 1,841 parts In-Stock

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$0.524

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1,841

$0.524

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American Microsemiconductor Inc.

USA . 84 parts In-Stock

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$0.870

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84

$0.870

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Vyrian

USA . 4,113 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,258 parts In-Stock

1+ parts

$0.497

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1,258

$0.497

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Corohmni

South Africa . 101 parts In-Stock

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$0.552

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101

$0.552

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AZTECH Wire

Italy . 834 parts In-Stock

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$17.650

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834

$17.650

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,014 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 7,118 parts In-Stock

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Continental Prestige Electronics

USA . 5,795 parts In-Stock

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$0.507

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$0.507

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SupplyDigital Components

Austria . 4,927 parts In-Stock

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Problanco Electronics

Mexico . 4,751 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,656 parts In-Stock

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Kulean Microsystems

USA . 2,951 parts In-Stock

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TANS Electronics

Latvia . 2,816 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

USA . 108 parts In-Stock

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108

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UHIMA Technologies

Türkiye . 66 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 48 parts In-Stock

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Overview

Experience the power and efficiency of the NTB90N02T4G Power Field Effect Transistor by Onsemi. Known for their top-notch quality and reliability, Onsemi products are trusted by industry professionals worldwide. This N-CHANNEL transistor with a built-in diode is designed for switching applications, offering enhanced performance and durability. With a high maximum drain current of 90 A and low on-resistance, this transistor delivers exceptional power handling capabilities. Ideal for a wide range of applications, the NTB90N02T4G provides customers with unmatched value and benefits, making it a must-have component for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance and efficiency compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and protection against reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 24 V

Can handle up to 24V safely, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 90 A

Capable of handling high currents, suitable for power applications.

Maximum Power Dissipation (Abs): 85 W

High power dissipation capability ensures efficient operation under heavy loads.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, making it suitable for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NTB90N02T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

733 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB90N02T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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