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NSD914XV2T1G

Onsemi

NSD914XV2T1G by Onsemi

NSD914XV2T1G by Onsemi is a single diode with reverse test voltage of 75V and max forward voltage of 1V. It has a small outline package style, matte tin terminal finish, and operates b/w -55 to 150 °C. Ideal for rectification applications in electronics due to its low reverse current and fast reverse recovery time.

Median Price

$0.043

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 46,586 parts In-Stock

1+ parts

$0.180

100+ parts

$0.066

1k+ parts

$0.042

10k+ parts

$0.031

46,586

$0.180

$0.066

$0.042

$0.031

Newark

USA . 900 parts In-Stock

1+ parts

$0.187

100+ parts

$0.072

1k+ parts

$0.048

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900

$0.187

$0.072

$0.048

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Verical

USA . 21,000 parts In-Stock

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$0.043

21,000

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$0.043

Chip1Stop

Japan . 12,000 parts In-Stock

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$0.038

12,000

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$0.038

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

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$0.043

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$0.036

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$0.032

6,000

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$0.043

$0.036

$0.032

DigiKey

USA . 2,395 parts In-Stock

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$0.028

2,395

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$0.028

Flip Electronics (Authorized)

USA . 1 parts In-Stock

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Digiode

USA . 1,487 parts In-Stock

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$0.033

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$0.033

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Vyrian

USA . 1,376 parts In-Stock

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$0.035

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1,376

$0.035

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Component Electronics Inc.

Canada . 7,042 parts In-Stock

1+ parts

$0.500

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$0.380

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$0.330

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7,042

$0.500

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$0.330

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ComSIT Distribution GmbH

Germany . 113,830 parts In-Stock

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ComSIT USA

USA . 113,830 parts In-Stock

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Chip Stock

USA . 76,000 parts In-Stock

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IBS Electronics

USA . 30,000 parts In-Stock

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$0.022

30,000

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$0.022

NexGen Digital

USA . 25,855 parts In-Stock

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NAC Semi

USA . 15,000 parts In-Stock

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$0.073

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$0.073

Microfarads

USA . 7,846 parts In-Stock

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Semtec, LLC

USA . 2,861 parts In-Stock

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2,861

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Cyclops Electronics Ltd

UK . 2,156 parts In-Stock

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PC Components Company LLC

USA . 791 parts In-Stock

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791

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Bristol Electronics

USA . 624 parts In-Stock

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624

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Prism Electronics

USA . 300 parts In-Stock

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300

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Sensible Micro Corp

USA . 124 parts In-Stock

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Flip Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,649 parts In-Stock

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$0.032

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Corohmni

South Africa . 256 parts In-Stock

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$0.035

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Component Stockers USA

USA . 145,777 parts In-Stock

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$0.040

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$0.030

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$0.030

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$0.040

145,777

$0.040

$0.030

$0.030

$0.040

Advanced Electronics

New Zealand . 870 parts In-Stock

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$0.217

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$0.197

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$0.178

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870

$0.217

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Perfect Parts

USA . 633,372 parts In-Stock

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RC Electronics

USA . 144,075 parts In-Stock

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Eastek

USA . 132,000 parts In-Stock

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SupplyDigital Components

Austria . 8,202 parts In-Stock

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Kulean Microsystems

USA . 6,878 parts In-Stock

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Continental Prestige Electronics

USA . 3,868 parts In-Stock

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$0.071

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Kepictronics

USA . 3,500 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 1,533 parts In-Stock

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Problanco Electronics

Mexico . 1,266 parts In-Stock

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Futuretech Components

Singapore . 600 parts In-Stock

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600

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UHIMA Technologies

Türkiye . 467 parts In-Stock

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467

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the NSD914XV2T1G by Onsemi, a top-quality diode rectifier that delivers exceptional performance and reliability. Onsemi, a trusted manufacturer in the industry, ensures that this product meets the highest standards for efficiency and durability. Ideal for a wide range of applications, this diode rectifier offers customers value by providing fast and efficient power conversion while maintaining low reverse current levels. Experience the benefits of seamless operation and peace of mind knowing you have a reliable solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides good protection for the diode and ensures durability, making it a reliable choice for various applications.

Config: SINGLE

Single configuration simplifies the design and installation process, making it easier to integrate this diode into different circuits.

Surface Mount: YES

Surface mount feature allows for easy and compact placement on circuit boards, saving space and facilitating automated assembly processes.

Maximum Reverse Recovery Time: 0.004 us

Ultra-fast reverse recovery time ensures efficient operation and minimal energy loss in high-speed applications, improving overall performance.

Maximum Reverse Current: 5 uA

Low reverse current minimizes power dissipation and enhances the efficiency of the diode, ultimately improving the energy-saving capability of the product.

Technical Specifications

Diodes & Rectifiers NSD914XV2T1G attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Application:

GENERAL PURPOSE

Minimum Breakdown Voltage:

100 V

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1 V

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

.5 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.2 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Maximum Reverse Current:

5 uA

Maximum Reverse Recovery Time:

.004 us

Reverse Test Voltage:

75 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NSD914XV2T1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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