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NRVB1045MFST3G

Onsemi

NRVB1045MFST3G by Onsemi

NRVB1045MFST3G by Onsemi is a Schottky rectifier diode with 45V max repetitive peak reverse voltage and 10A max output current. It operates b/w -55 to 150 °C, ideal for efficiency applications. This single-config diode has a small outline package style and matte tin terminal finish for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

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1k+

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Chip Stock

USA . 36,000 parts In-Stock

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Component Stockers USA

USA . 6,871 parts In-Stock

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$8.340

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AZTECH Wire

Italy . 966 parts In-Stock

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Kulean Microsystems

USA . 6,943 parts In-Stock

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TANS Electronics

Latvia . 3,451 parts In-Stock

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Problanco Electronics

Mexico . 833 parts In-Stock

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SupplyDigital Components

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Overview

Discover the NRVB1045MFST3G by Onsemi, a high-quality rectifier diode that offers unparalleled efficiency and reliability. Manufactured by Onsemi, a trusted industry leader, this diode is perfect for a wide range of applications where precision and performance are critical. With a maximum output current of 10A and a maximum reverse voltage of 45V, this Schottky technology diode provides exceptional value and benefits to customers seeking superior performance in their electronic devices. Upgrade your projects with the NRVB1045MFST3G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Reverse Current: 500 uA

Ensures efficient performance and helps prevent damage from reverse currents.

Application: EFFICIENCY

Designed for applications where efficiency is key, contributing to overall system performance.

Maximum Operating Temperature: 150 °C

Can operate effectively in a wide range of temperatures, providing versatility.

Diode Type: RECTIFIER DIODE

Specifically designed for rectifying alternating current, making it suitable for power supply applications.

Technology: SCHOTTKY

Schottky diodes have low forward voltage drop and fast switching capabilities, making them ideal for high frequency applications.

Technical Specifications

Diodes & Rectifiers NRVB1045MFST3G attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Additional Features:

FREE WHEELING DIODE, LOW POWER LOSS

Application:

EFFICIENCY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.75 V

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

150 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

45 V

Maximum Reverse Current:

500 uA

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NRVB1045MFST3G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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