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NMF3010FCT1G

Onsemi

NMF3010FCT1G by Onsemi

NMF3010FCT1G by Onsemi is a data line filter with 2 functions and 6 terminals. It has a max operating temperature of 85 °C, DC resistance of 1050 ohm, and output impedance of 50 ohm. Ideal for applications requiring surface mount filters with dimensions of L1.489xB0.989xH0.7 mm such as electronic devices or communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Vyrian

USA . 3,490 parts In-Stock

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Digiode

USA . 1,461 parts In-Stock

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AZTECH Wire

Italy . 750 parts In-Stock

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$13.960

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Kulean Microsystems

USA . 6,503 parts In-Stock

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Problanco Electronics

Mexico . 5,718 parts In-Stock

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TANS Electronics

Latvia . 4,571 parts In-Stock

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SupplyDigital Components

Austria . 4,059 parts In-Stock

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Corphita

USA . 2,319 parts In-Stock

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UHIMA Technologies

Türkiye . 505 parts In-Stock

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Corohmni

South Africa . 301 parts In-Stock

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Microchip USA

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Vigor

Singapore . 247 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NMF3010FCT1G data line filter by Onsemi. With a reputation for high-quality components, Onsemi brings you a product that offers reliable filtering solutions for your applications. Whether you're looking to reduce noise interference or improve signal quality, this filter with dual functions and six terminals delivers exceptional value and benefits. Trust Onsemi to provide you with the best-in-class components to enhance the performance and longevity of your electronics.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions allows for versatile filtering options and better noise suppression.

No. of Terminals: 6

With 6 terminals, this data line filter provides multiple connection options and ensures secure connections.

Filter Type: DATA LINE FILTER

Being a data line filter, it effectively reduces EMI and noise in data transmission, ensuring clean and reliable data signals.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this filter can handle demanding environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C makes this filter suitable for a wide range of operating conditions.

Width (mm): 0.989

The compact width of 0.989mm allows for easy integration into small spaces or dense circuit layouts.

Maximum DC Resistance: 1050 ohm

The low maximum DC resistance of 1050 ohms ensures minimal voltage drop and efficient power transfer.

Length: 1.489 mm

The small length of 1.489mm helps in saving space and reducing the overall footprint of the filter in a circuit design.

Output Impedance (ohm): 50 OHM

With an output impedance of 50 ohms, this filter matches well with standard impedance levels in data transmission, ensuring signal integrity.

Packing Method: TAPE AND REEL

The tape and reel packing method allows for easy handling during manufacturing and automated assembly processes.

Mounting Type: SURFACE MOUNT

Being surface mountable, this filter is easy to install and suitable for modern SMT assembly processes.

Dimensions: L1.489XB0.989XH0.7 (mm)/L0.059XB0.039XH0.028 (inch)

The compact dimensions make this filter suitable for space-constrained applications and enable versatile mounting options.

Package Material: PLASTIC

The use of plastic as the package material makes this filter lightweight and durable for various applications.

Height: 0.7 mm

The low height of 0.7mm ensures the filter can be placed in slim devices or stacked in compact layouts.

Capacitance: 1000 uF

With a capacitance of 1000uF, this filter can effectively smooth out voltage fluctuations and provide stable power to connected devices.

Technical Specifications

Data Line Filters NMF3010FCT1G attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Capacitance:

1000 uF

Maximum DC Resistance:

Filter Type:

Height:

.7 mm

Length:

1.489 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Package Material:

PLASTIC

Packing Method:

TAPE AND REEL

Dimensions:

L1.489XB0.989XH0.7 (mm)/L0.059XB0.039XH0.028 (inch)

Sub-Category:

Data Line Filters

Width (mm):

0.989

Trade Compliance

NMF3010FCT1G Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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