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NL3S2223MUTBG

Onsemi

NL3S2223MUTBG by Onsemi

NL3S2223MUTBG by Onsemi is a DPDT chip carrier switch with 10 terminals, 2 channels, and a very thin profile. It operates b/w -40 to 85 °C with a max voltage of 4.5 V. Ideal for industrial applications requiring fast switching times and high isolation levels.

Median Price

$0.204

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 547,888 parts In-Stock

1+ parts

-

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$0.230

547,888

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$0.230

Flip Electronics (Authorized)

USA . 547,888 parts In-Stock

1+ parts

-

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547,888

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Rochester

USA . 368,300 parts In-Stock

1+ parts

-

100+ parts

$0.204

1k+ parts

$0.170

10k+ parts

$0.151

368,300

-

$0.204

$0.170

$0.151

Verical

USA . 272,300 parts In-Stock

1+ parts

-

100+ parts

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$0.189

272,300

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$0.189

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,084 parts In-Stock

1+ parts

$0.160

100+ parts

-

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1,084

$0.160

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Vyrian

USA . 925 parts In-Stock

1+ parts

$0.168

100+ parts

-

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925

$0.168

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Flip Electronics

USA . 547,888 parts In-Stock

1+ parts

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10k+ parts

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547,888

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,690 parts In-Stock

1+ parts

$0.151

100+ parts

-

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1,690

$0.151

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$0.168

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249

$0.168

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Advanced Electronics

New Zealand . 47 parts In-Stock

1+ parts

$10.533

100+ parts

$9.585

1k+ parts

$8.637

10k+ parts

-

47

$10.533

$9.585

$8.637

-

Continental Prestige Electronics

USA . 368,300 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.144

10k+ parts

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368,300

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-

$0.144

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Kepictronics

USA . 328,800 parts In-Stock

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328,800

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Problanco Electronics

Mexico . 7,556 parts In-Stock

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7,556

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SupplyDigital Components

Austria . 5,475 parts In-Stock

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TANS Electronics

Latvia . 4,297 parts In-Stock

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4,297

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Kulean Microsystems

USA . 2,920 parts In-Stock

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2,920

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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UHIMA Technologies

Türkiye . 330 parts In-Stock

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330

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Microchip USA

USA . 196 parts In-Stock

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196

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Overview

Enhance your electronic systems with the NL3S2223MUTBG by Onsemi, a top-quality multiplexer and switch that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its surface mount design and compact size, it provides exceptional value and efficiency to customers. Upgrade your projects with the NL3S2223MUTBG and experience seamless operation like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 2.7 V

Compatible with a common supply voltage, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile and chip carrier package style save space on the circuit board, allowing for compact designs.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity, ensuring reliable performance and longevity.

Width (mm): 1.4 mm

Compact width allows for dense packing on the circuit board, optimizing space usage.

Maximum On-state Resistance (Ron): 8.6 ohm

Low on-state resistance minimizes power loss and ensures efficient signal transmission.

No. of Channels: 2

Dual channels provide flexibility and enable the routing of multiple signals simultaneously.

Technical Specifications

Multiplexers & Switches NL3S2223MUTBG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N10

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

22 dB

Nominal On-state Resistance Match:

.6 ohm

Maximum On-state Resistance (Ron):

8.6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

30 ns

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

NL3S2223MUTBG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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