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NIS6201DR2G

Onsemi

NIS6201DR2G by Onsemi

NIS6201DR2G by Onsemi is a small outline switched capacitor regulator with 15V nominal voltage and 1450 kHz max switching frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C, has a tin terminal finish, and comes in a rectangular plastic/epoxy package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,410 parts In-Stock

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Digiode

USA . 467 parts In-Stock

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467

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AZTECH Wire

Italy . 670 parts In-Stock

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$19.010

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670

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Component Stockers USA

USA . 321 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,465 parts In-Stock

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Microchip USA

USA . 5,645 parts In-Stock

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Kulean Microsystems

USA . 3,887 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,024 parts In-Stock

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SupplyDigital Components

Austria . 2,642 parts In-Stock

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Corphita

USA . 557 parts In-Stock

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Vigor

Singapore . 466 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Problanco Electronics

Mexico . 287 parts In-Stock

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UHIMA Technologies

Türkiye . 120 parts In-Stock

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Overview

Discover the cutting-edge NIS6201DR2G by Onsemi, a versatile switching regulator and controller that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted industry leader, this innovative product is perfect for a wide range of applications. Its compact design and advanced technology make it an ideal choice for automotive and other demanding environments. Experience the value and benefits this product brings, delivering superior performance and efficiency to meet your specific needs. Elevate your projects with the NIS6201DR2G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability makes it easier to integrate the product onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 15 V

Having a nominal supply voltage of 15V ensures compatibility with a wide range of applications that require this specific voltage level.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to operate reliably in various environmental conditions, making it suitable for industrial or automotive use.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high efficiency, making the product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Switching Regulators & Controllers NIS6201DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Switcher Config:

DOUBLER INVERTER

Maximum Switching Frequency:

1450 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NIS6201DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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