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NE592D14R2

Onsemi

NE592D14R2 by Onsemi

NE592D14R2 by Onsemi is a video amplifier IC with +-6V power supplies, 90kHz bandwidth, and 27mA max supply current. It is used in audio/video applications due to its small outline package and commercial temperature grade suitability.

Median Price

$1.031

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,515 parts In-Stock

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Digiode

USA . 1,593 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 527 parts In-Stock

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Bristol Electronics

USA . 527 parts In-Stock

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$1.031

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$0.578

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527

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$1.031

$0.578

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Dan-Mar Components

USA . 527 parts In-Stock

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527

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Distributors (Availability)

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AZTECH Wire

Italy . 632 parts In-Stock

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$12.480

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QUARKTWIN TECHNOLOGY LTD

USA . 24,757 parts In-Stock

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Kulean Microsystems

USA . 6,730 parts In-Stock

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Lixinc

USA . 6,052 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 5,962 parts In-Stock

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SupplyDigital Components

Austria . 2,841 parts In-Stock

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Corphita

USA . 2,490 parts In-Stock

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TANS Electronics

Latvia . 1,133 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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UHIMA Technologies

Türkiye . 241 parts In-Stock

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Vigor

Singapore . 143 parts In-Stock

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Microchip USA

USA . 136 parts In-Stock

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Overview

Enhance your audio and video experiences with the NE592D14R2 by Onsemi. As a leader in the industry, Onsemi ensures top-quality products that guarantee reliability and performance. With applications in audio and video amplifiers, this product offers customers the value of clear sound and crisp images, making it the perfect choice for your entertainment needs. Upgrade your systems today with the NE592D14R2 and enjoy a whole new level of audio and video quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection against external elements, extending the lifespan of the product.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, ensuring high-quality video output.

Power Supplies (V): +-6

Compatible with a wide range of power supplies, making it versatile for different setups.

Maximum Operating Temperature: 70 °C

Can operate efficiently even in high-temperature environments, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

Operates at low temperatures as well, providing flexibility for various operating conditions.

Nominal Bandwidth: 90 kHz

Delivers high bandwidth capability, ideal for processing and amplifying video signals with clarity.

Technical Specifications

Audio & Video Amplifiers NE592D14R2 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

90 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NE592D14R2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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