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NE5532AD8R2

Onsemi

NE5532AD8R2 by Onsemi

NE5532AD8R2 by Onsemi is a dual operational amplifier with 100dB CMRR and 10kHz unity gain bandwidth. It operates on +-15V supplies, has 1uA bias current, and is ideal for audio applications due to its high voltage gain and low offset voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 73,000 parts In-Stock

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Vyrian

USA . 4,681 parts In-Stock

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Digiode

USA . 2,417 parts In-Stock

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AZTECH Wire

Italy . 988 parts In-Stock

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$18.030

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Component Stockers USA

USA . 757 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 3,192 parts In-Stock

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Kulean Microsystems

USA . 1,928 parts In-Stock

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Problanco Electronics

Mexico . 1,171 parts In-Stock

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UHIMA Technologies

Türkiye . 706 parts In-Stock

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TANS Electronics

Latvia . 393 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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Vigor

Singapore . 311 parts In-Stock

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Microchip USA

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Corphita

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Overview

Discover the NE5532AD8R2 by Onsemi, a high-quality operational amplifier that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this op amp is perfect for a wide range of applications. From audio equipment to precision instrumentation, this product delivers outstanding value with its low input offset voltage and high common mode rejection ratio. Upgrade your designs with the NE5532AD8R2 and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 5000 uV

Ensures precise and accurate signal processing.

Maximum Average Bias Current (IIB): 1 uA

Low bias current ensures minimal power consumption.

Surface Mount: YES

Allows for easy installation on circuit boards.

No. of Functions: 2

Provides versatility in circuit design.

Nominal Common Mode Reject Ratio: 100 dB

Ensures rejection of common mode signals for cleaner output.

Nominal Supply Voltage / Vsup (V): 15

Operates at a standard supply voltage for compatibility with other components.

Power Supplies (V): +-15

Allows for dual power supply operation.

No. of Terminals: 8

Provides multiple connection points for various functions.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board.

Maximum Supply Voltage Limit: 22 V

Can withstand higher supply voltages for added versatility.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperature environments.

Frequency Compensation: YES

Provides stability and prevent oscillations in the output signal.

Minimum Voltage Gain: 10000

High voltage gain amplifies weak signals effectively.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good conductivity and solderability.

Terminal Position: DUAL

Allows for flexible connections in circuit designs.

Maximum Seated Height: 1.75 mm

Low profile design for compact installations.

Width: 3.9 mm

Compact size for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for soldering.

Peak Reflow Temperature °C: 235

Can withstand high soldering temperatures without damage.

Length: 4.9 mm

Compact size for space-constrained applications.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Maximum Negative Supply Voltage Limit: -22 V

Allows for dual power supply operation with negative voltage.

Nominal Unity Gain Bandwidth: 10000 kHz

High unity gain bandwidth for fast signal processing.

Technology: BIPOLAR

Provides high-performance amplification with low noise.

Terminal Form: GULL WING

Easy to solder on the circuit board.

Amplifier Type: OPERATIONAL AMPLIFIER

Suitable for a wide range of signal processing applications.

Maximum Supply Current: 16 mA

Can provide sufficient current for various functions.

Nominal Negative Supply Voltage (Vsup): -15 V

Allows for dual power supply operation with negative voltage.

Architecture: VOLTAGE-FEEDBACK

Provides stable and reliable voltage feedback for accurate signal processing.

Packing Method: TAPE AND REEL

Easy and convenient packaging for mass production.

Nominal Slow Rate: 9 V/us

Gradual slew rate for smooth signal processing.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connections.

Technical Specifications

Operational Amplifiers (Op Amps) NE5532AD8R2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

9 V/us

Peak Bias Current:

1 uA

Maximum Bias Current (IIB) @25 °C:

800 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

235 °C (455 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

16 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

NE5532AD8R2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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