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NCV891334MW33R2G

Onsemi

NCV891334MW33R2G by Onsemi

NCV891334MW33R2G by Onsemi is a switching regulator with 3A output current, 3.234V min output voltage, and 150 °C max operating temperature. Ideal for automotive applications, it operates in voltage-mode control technique with a buck switcher configuration.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 22,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14,730 parts In-Stock

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ComSIT USA

USA . 14,730 parts In-Stock

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Vyrian

USA . 12,161 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 931 parts In-Stock

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Problanco Electronics

Mexico . 7,608 parts In-Stock

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Kulean Microsystems

USA . 7,581 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,552 parts In-Stock

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SupplyDigital Components

Austria . 2,649 parts In-Stock

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TANS Electronics

Latvia . 873 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 218 parts In-Stock

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Corphita

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Overview

Experience the cutting-edge technology with the NCV891334MW33R2G by Onsemi. This high-quality switching regulator offers unparalleled efficiency and reliability, making it a top choice for automotive applications. With a wide input voltage range and precise control mode, this product ensures optimal performance even in challenging conditions. Trust Onsemi's expertise in manufacturing to deliver a product that exceeds expectations, providing value and peace of mind to customers looking for superior solutions in the field of switching regulators and controllers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a cost-effective and lightweight solution for the package body, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and enabling automated assembly processes.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environments and operate reliably in industrial and automotive applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability, ensuring efficient power conversion and performance.

Nominal Input Voltage: 13.2 V

The nominal input voltage of 13.2 V is ideal for various power supply designs and systems, providing compatibility with common power sources.

Maximum Output Current: 3 A

The high maximum output current capability of 3 A allows for powering a range of components and devices in the circuit with sufficient current capacity.

Technical Specifications

Switching Regulators & Controllers NCV891334MW33R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

13.2 V

JESD-30 Code:

S-PDSO-N12

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Maximum Output Voltage:

3.366 V

Minimum Output Voltage:

3.234 V

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC12,.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2.2 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

PIN/PEG

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

NCV891334MW33R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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