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NCV890231MWTXG

Onsemi

NCV890231MWTXG by Onsemi

NCV890231MWTXG by Onsemi is a switching regulator with 2.7A output current, 3.3V nominal output voltage, and 2200kHz max switching frequency. It is ideal for industrial applications requiring a compact design and efficient power management in a wide temperature range from -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,968 parts In-Stock

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11,968

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Digiode

USA . 1,777 parts In-Stock

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1,777

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,352 parts In-Stock

1+ parts

$3.585

100+ parts

$3.549

1k+ parts

$3.406

10k+ parts

-

3,352

$3.585

$3.549

$3.406

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Ampacity Inc.

Singapore . 916 parts In-Stock

1+ parts

$7.500

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916

$7.500

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AZTECH Wire

Italy . 736 parts In-Stock

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$22.240

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736

$22.240

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Kulean Microsystems

USA . 6,723 parts In-Stock

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6,723

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TANS Electronics

Latvia . 5,629 parts In-Stock

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5,629

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SupplyDigital Components

Austria . 4,569 parts In-Stock

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4,569

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,134 parts In-Stock

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1,134

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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770

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Microchip USA

USA . 475 parts In-Stock

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475

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Corohmni

South Africa . 272 parts In-Stock

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272

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Problanco Electronics

Mexico . 135 parts In-Stock

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135

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Overview

Unleash the power of the NCV890231MWTXG by Onsemi, a cutting-edge switching regulator & controller that delivers top-notch quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unmatched performance and efficiency. Ideal for a wide range of applications, this small outline, heat sink package ensures very thin profile and high durability. With a control mode of current-mode and pulse width modulation technique, customers can expect precise control and optimal power management. Experience seamless operation with the NCV890231MWTXG, providing a nominal output voltage of 3.3V and a maximum output current of 2.7A. Elevate your projects with this industrial-grade solution that guarantees exceptional value and benefits to every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, saving time and effort in production.

Maximum Output Current: 2.7 A

High maximum output current allows the product to power a variety of devices or circuits effectively and efficiently.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise regulation of output voltage, ensuring stability and performance of the product.

Nominal Input Voltage: 13.2 V

Optimal nominal input voltage range allows for compatibility with a wide range of power sources, making the product versatile in different applications.

Technical Specifications

Switching Regulators & Controllers NCV890231MWTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE DOWN TO 0.8V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

36 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

13.2 V

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.7 A

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NCV890231MWTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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